Semiconductor package assembly with dual heat sink plates

Abstract

A semiconductor package assembly includes: a first semiconductor package, and a first semiconductor element and a first set of conductive patterns exposed on its front surface; an interposer mounted on the front surface of the first semiconductor package via a set of interconnect structures, wherein the interposer includes a second set of conductive patterns on its rear surface, the second set of conductive patterns being aligned with the first set of conductive patterns to be electrically connected to each other via the set of interconnect structures; the interposer further includes at least one opening through the interposer; a second semiconductor package mounted on the front surface of the interposer; and a heat sink including a rear heat sink mounted between the first semiconductor package and the interposer and thermally coupled to the first semiconductor element; a front heat sink mounted between the interposer and the second semiconductor package and contacting the front surface of the interposer; and a heat sink connector extending through the at least one opening and connecting the rear heat sink and the front heat sink.