Method of manufacturing semiconductor device structure and deposition apparatus

Abstract

A device structure may be manufactured by: disposing a semiconductor package on a package tray, wherein the package tray includes a tray base portion which laterally extends underneath the semiconductor package, a tray mesa portion which protrudes upward from the tray base portion and including a contiguous set of mesa-portion sidewalls, and a frame-shaped support portion including a continuous set of support-portion outer sidewalls that is laterally offset inward from a package area that is defined by a set of all sidewalls of the semiconductor package in a plan view; and anisotropically depositing an electromagnetic interference (EMI) shielding film on the set of all sidewalls of the semiconductor package and on a top surface of the semiconductor package.