Integrated circuit substrate stiffener
TW202629002APending Publication Date: 2026-07-01ARM LTD
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Patent Information
- Application Number
- TW114148835
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-24
- Filing Date
- 2025-12-12
- Publication Date
- 2026-07-01
Abstract
An integrated circuit assembly comprises a substrate, and an integrated circuit die physically and electrically attached to the substrate. A stiffener is attached to the substrate, the stiffener comprising a planar portion and a protruding portion, the planar portion to be attached to the substrate and to be positioned approximately parallel to a planar surface of the substrate, the protruding portion to extend away from the planar portion of the stiffener.
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