Electronic package having stepped stacked substrate structure

Abstract

In an aspect, an electronic device includes a plurality of stacked substrates, each substrate includes a first planar surface and a second planar surface opposite the first planar surface. Adjacent substrates are stacked so that the second planar surface of each upper substrate of the adjacent substrates extends beyond the first planar surface of each lower substrate of the adjacent substrates to form planar connection surfaces at the second planar surface of the upper substrate of the adjacent substrates, A redistribution layer underlies the stacked substrates. Conductive pillars extend in a direction perpendicular to the planar connection surface of each upper substrate of the adjacent substrates to electrically connect the electronic components of each upper substrate to the redistribution layer.