Semiconductor devices and methods for manufacturing semiconductor devices

Abstract

This invention facilitates the routing of electrodes onto a sealing member. A semiconductor device according to an embodiment includes a wiring substrate, a multilayer, a sealing member, and through electrodes. The multilayer includes first to third semiconductor wafers, the first to third semiconductor wafers having a first surface disposed obliquely relative to the wiring substrate at a position opposite to the wiring substrate. Each of the first to third semiconductor wafers has an electrode pad at an end of its first surface. A second semiconductor wafer is deposited in a first direction on top of the first semiconductor wafer, without overlapping the electrode pads of the first semiconductor wafer. A third semiconductor wafer is deposited in the first direction on top of the second semiconductor wafer, without overlapping the electrode pads of the second semiconductor wafer. The sealing member covering the multilayer has a third surface on the electrode pad side of the multilayer, the third surface being parallel to the plane of the electrode pad containing at least two semiconductor wafers. A plurality of through electrodes extend from the electrode pads within the sealing member along a second direction orthogonal to the first direction and are connected to the wiring substrate.