Semiconductor devices, methods for manufacturing semiconductor devices

Abstract

The objective of this invention is to achieve miniaturization of the semiconductor chip in a semiconductor device of the type in which a cover covers a semiconductor chip mounted on a wiring substrate. The semiconductor device of this invention includes: a semiconductor chip; a wiring substrate for mounting the semiconductor chip, having external connection terminals formed on a side opposite to the side on which the semiconductor chip is mounted (i.e., the front side) for electrical connection to an external source; and a cover that is attached to the semiconductor chip by a bonding member formed on the outer edge of the semiconductor chip, covering the semiconductor chip; and a portion of the bonding member extends outward beyond the outer edge of the semiconductor chip.