Laser processing systems and laser processing methods

TW202629334APending Publication Date: 2026-07-16HAMAMATSU PHOTONICS KK
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Patent Information

Application Number
TW114137215
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-07
Filing Date
2025-09-26
Publication Date
2026-07-16
Patent Text Reader

Abstract

A laser processing system is provided for performing laser processing in which a modified region is formed on a target object by irradiating the target object with laser light. The system comprises: an input receiving unit that receives input of the thickness of the target object in the Z direction intersecting the incident plane of the laser light, and processing information including at least one of the processing time and the processing quality of the laser processing; a category determining unit that determines the processing category of the laser processing in response to the processing information received by the input receiving unit; and a first condition determining unit that determines the processing conditions, i.e., the first processing conditions, which serve as the basis for the laser processing, based on the thickness received by the input receiving unit and the processing category determined by the category determining unit.
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