Grinding apparatus and grinding equipment

Abstract

This disclosure provides a polishing apparatus and polishing device for removing a film from a substrate surface, comprising: a polishing table for holding and rotating the substrate; and a polishing head having a polishing pad for contacting and pressing against the substrate to polish the substrate surface film, the area of ​​the polishing pad being less than or equal to the area of ​​the substrate; wherein the substrate is divided into at least two regions in the circumferential direction according to the thickness distribution of the substrate surface film, the at least two regions including a first region and a second region; during the polishing of the substrate surface, the substrate is kept rotating, and the polishing head is configured to polish the first region at a first polishing rate and polish the second region at a second polishing rate, the first polishing rate and the second polishing rate being different.

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