Abrasive pads, methods for manufacturing abrasive pads, and methods for abrading the surfaces of optical or semiconductor materials.

Abstract

The object of this invention is to provide a polishing pad that can shorten the start-up processing time and suppress the formation of scratches in the initial polishing stage. A polishing pad has an polishing layer comprising a polyurethane resin and a low molecular weight polyol, having bubbles in a generally teardrop shape, wherein the mass (mg) ratio of the low molecular weight polyol to the mass (g) of the polishing layer is 0.1 mg / g or more and 8.0 mg / g or less.