Nozzle change unit and nozzle change method, semiconductor material cutting and sorting equipment

Abstract

The present invention provides a nozzle change unit and a nozzle change method, and a semiconductor material cutting and sorting equipment. The nozzle change unit of the present invention includes: a nozzle accommodating portion, having a first nozzle accommodating portion and a second nozzle accommodating portion configured opposite to the first nozzle accommodating portion; and a photoelectric detection sensor, having a light-emitting portion and a light-receiving portion respectively disposed on the first nozzle accommodating portion and the second nozzle accommodating portion. When a first picker positioned at an odd-numbered sequence in a wafer picking unit moves from a first height down to a second height, and the wafer picking unit moves along a first horizontal direction, the photoelectric detection sensor detects whether a nozzle is mounted on the first picker. When a second picker positioned at an even-numbered sequence in the wafer picking unit moves from the first height down to the second height, and the wafer picking unit moves along the first horizontal direction, the photoelectric detection sensor detects whether a nozzle is mounted on the second picker.