Resin sealing device and resin sealing method

Abstract

This invention provides a resin sealing device that can cool the lower surface of a resin seal without increasing the number of transfers. The resin sealing device 1 includes: a pressing module 3 having a mold 32 for sealing a workpiece w with resin; an unloading machine 13 for entering the pressing module 3 and recovering the resin seal W with unwanted resin portions R; a cutting head 42 for separating unwanted resin portions R from the resin seal W transported by the unloading machine 13; and cooling devices 41 and 14, which are disposed in the transport path between the pressing module 3 and the cutting head 42 and blow refrigerant A onto the lower surface W2 of the resin seal W held by the unloading machine 13.