Single-piece sealing gasket

TW202629476AActive Publication Date: 2026-07-16楊嚴武
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
楊嚴武
Filing Date
2025-01-06
Publication Date
2026-07-16

AI Technical Summary

Technical Problem

Conventional sealing gaskets are difficult to open and tend to become thicker due to flap structures or unbonded areas, compromising user convenience and sealing effectiveness.

Method used

A single-piece sealing gasket design comprising an upper layer, connecting layer, and adhesive-sealing composite layer, utilizing electromagnetic induction heating and adhesive layers to facilitate easy opening without external tools, while maintaining airtightness and reducing thickness.

Benefits of technology

The gasket allows easy opening by pinching the coating structure, ensuring airtightness and reducing thickness without the need for flap structures, enhancing user convenience and sealing performance.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure TWG2TA001067798_001
    Figure TWG2TA001067798_001
Patent Text Reader

Abstract

This application provides a one-piece sealing gasket, which, from top to bottom, comprises an upper layer, a connecting layer, and an adhesive composite layer. The upper layer includes a surface film. The connecting layer includes a bonding adhesive and a coating area. The adhesive composite layer, from top to bottom, comprises an electromagnetic induction heating layer and an adhesive layer. The coating area is a localized area coated on the lower surface of the upper layer, and the connecting layer bonds the upper layer and the adhesive composite layer together through the bonding adhesive. The aforementioned one-piece sealing gasket improves the ease of opening for the user.
Need to check novelty before this filing date? Find Prior Art

Description

[Technical Field]

[0001] This case relates to a sealing gasket, and more particularly to a single-piece sealing gasket. [Previous Technology]

[0002] Note that, in order to prevent leakage of contents and spoilage due to external environmental influences, sealing gaskets are used to seal the openings of packaging containers such as beverage cans and medicine cans. Furthermore, sealing gaskets are generally made of materials such as aluminum foil or cardboard. More specifically, conventionally known single-piece sealing gaskets generally refer to sealing gaskets containing aluminum foil.

[0003] By using a sealing gasket that is tightly sealed to the container opening, it is possible to prevent leakage of the contents and to seal and preserve the contents.

[0004] In addition, in order to improve the ease of opening the sealing gasket, some sealing gaskets are equipped with a flap structure or retain a part of the unbonded area in the sealing gasket. [Summary of the Invention]

[0005] However, because conventional sealing gaskets are designed primarily for sealing performance and not for ease of opening, the aluminum foil or cardboard at the container opening is difficult to open with a finger, and cutting it with a knife or poking it with an awl is both troublesome and dangerous, causing inconvenience to the user. Furthermore, although some sealing gaskets are configured with a flap structure or retain a portion of unbonded area within the sealing gasket, this often results in the sealing gasket becoming thicker due to the flap or unbonded area.

[0006] Therefore, how to solve the above-mentioned problems encountered by conventional sealing gaskets, and effectively improve the convenience of opening and avoid unnecessary thickening of sealing gaskets, has become an urgent problem that this technical field hopes to solve.

[0007] To solve the above problems, this invention provides a single-piece sealing gasket, which, from top to bottom, comprises an upper layer, a connecting layer, and an adhesive-sealing composite layer. The upper layer comprises a surface film. The connecting layer comprises a connecting adhesive and a coating area. The adhesive-sealing composite layer, from top to bottom, comprises an electromagnetic induction heating layer and an adhesive layer. The coating area is a local area coated on the lower surface of the upper layer, and the connecting layer is used to bond the upper layer and the adhesive-sealing composite layer through the connecting adhesive.

[0008] In some embodiments, the cross-sectional width of the local area is greater than or equal to one-sixth of the cross-sectional width of the single-piece sealing gasket, and the cross-sectional width of the local area is less than or equal to five-sixths of the cross-sectional width of the single-piece sealing gasket.

[0009] In some embodiments, the material of the coating area is varnish or silicone oil.

[0010] In some embodiments, the coating method of the coating area is full-area coating or dot coating.

[0011] In some embodiments, the adhesive composite layer further includes a bonding membrane. The bonding membrane is disposed above the electromagnetic induction heating layer. The bonding membrane is made of at least one material selected from the group consisting of polyethylene (PE), polypropylene (PP), polyamide (PA), expandable polypropylene (EPP), and expandable polyethylene (EPE).

[0012] In some embodiments, the adhesive composite layer further comprises a composite film. The composite film is disposed above the electromagnetic induction heating layer. The composite film is made of at least one material selected from the group consisting of polyethylene terephthalate (PET), PA, polyethylene naphthalate (PEN), PE, and PP.

[0013] In some embodiments, the material of the surface film is selected from at least one of the group consisting of PP, PET, PE, PA and ethylene-methyl acrylate copolymer (EMAC).

[0014] In some embodiments, the sealing layer is a combination of hot melt adhesive or sealing film and adhesive. The hot melt adhesive is selected from at least one of the group consisting of ethylene / vinyl acetate copolymer (EVA), polyisobutylene (PIB), ethylene butyl acrylate copolymer (EBA), ethylene acrylate copolymer (EAA), EMAC, polyacrylate, acrylic copolymer, and ethylene methacrylic acid copolymer (EMAA). The sealing film is selected from PE, PP, PA, polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer, and other materials. The adhesive is disposed between the sealing film and the electromagnetic induction heating layer, and is at least one of the group consisting of EVOH and PET.

[0015] In some embodiments, the adhesive is a dry composite adhesive or a hot melt laminate, and the material of the hot melt laminate is selected from at least one of the group consisting of PE, PP, EMAC, EMAA, EAA, ethylene ethyl acrylate copolymer (EEA) and ethylene methyl methacrylate copolymer (EMMA).

[0016] In some embodiments, the adhesive system makes the peel strength between the upper layer and the adhesive composite layer greater than or equal to 17.8 N / 15 mm.

[0017] In some embodiments, the electromagnetic induction heating layer is an aluminum foil or a wireless information integration sheet.

[0018] In some embodiments, the wireless information integration sheet includes a base film, an information and heating layer, and a first adhesive layer. The information and heating layer includes an information area and an electromagnetic induction heating ring. The first adhesive layer is located between the base film and the information and heating layer. The information area has an antenna and a chip that are mutually conductive, and the electromagnetic induction heating ring surrounds the information area in a planar view.

[0019] In some embodiments, the wireless information integration sheet further includes a protective layer and a second adhesive layer, wherein the protective layer is located on the side of the information and heating layer away from the base film, and the second adhesive layer is located between the information and heating layer and the protective layer.

[0020] In some embodiments, there is a gap between the electromagnetic induction heating ring and the information area. In other embodiments, the gap is the distance between the outermost edge of the information area and the innermost edge of the electromagnetic induction heating ring, which is 0.1 mm to 3 mm. In still other preferred embodiments, the gap between the electromagnetic induction heating ring and the information area is completely filled.

[0021] In some embodiments, the information and heating layer further includes at least one physical connection bridge, which is used to connect the information area and the electromagnetic induction heating ring.

[0022] Those skilled in the art to which this application pertains can use the single-piece sealing gasket provided in this application to not only prevent leakage of contents and deterioration due to external environmental influences, but also allow users to easily peel off the single-piece sealing gasket of the container opening by directly pinching the coating structure (i.e., the structure above the coating area in the bonding layer) without the aid of external objects, thereby further achieving the effects of easy opening and reducing the thickness of the sealing gasket.

[0023] One aspect of this invention is based on the problems of the aforementioned prior art, and its purpose is to provide a single-piece sealing gasket that can further improve the ease of opening for the user and reduce the thickness of the sealing gasket. In other words, the single-piece sealing gasket provided in this invention can simultaneously ensure the airtightness of the contents, the ease of opening for the user, and reduce the thickness of the sealing gasket.

Implementation Method

[0025] The following describes the implementation of this application through specific embodiments. Those skilled in the art can understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of this application.

[0026] Unless otherwise stated herein, the term "A to B" as used in the specification and the appended claims includes the meaning of "more than A and less than B". For example, the term "10 to 40% by weight" includes the meaning of "more than 10% by weight and less than 40% by weight".

[0027] Furthermore, in the description of this case, it should be noted that terms such as "first," "second," and "third" are used to distinguish between elements, rather than to limit the elements themselves or indicate a specific order of elements. It should be noted that in the description described below, the same elements or steps may be represented by the same number.

[0028] Please refer to FIG1, which is a cross-sectional schematic diagram illustrating the single-piece sealing gasket 50 of the first embodiment of this invention. As shown in FIG1, the single-piece sealing gasket 50 comprises, from top to bottom, an upper layer 100, a connecting layer 200, and an adhesive composite layer 300. The upper layer 100 includes a surface film 110, the connecting layer 200 includes a connecting adhesive 210 and a coating area 220, and the adhesive composite layer 300 comprises, from top to bottom, an electromagnetic induction heating layer 310 and an adhesive layer 320. The various structures will be described in more detail below.

[0029] <<Upper Layer 100>> The upper layer 100 is disposed on the topmost layer of the monolithic sealing gasket 50. Taking FIG. 1 as an example, the upper layer 100 includes a surface film 110, which serves as the topmost layer (i.e., the surface layer) of the monolithic sealing gasket 50. In some embodiments, the upper and / or lower surfaces of the surface film 110 may be printable surfaces, which may be used to print different patterns. In some embodiments, the material of the surface film 110 may be at least one selected from the group consisting of PP, PET, PE, PA, and EMAC. Furthermore, the thickness of the surface film 110 is preferably 12 to 150 µm, within which tensile strength is greater, surface is smoother, and gloss is better; additionally, when heat conduction is felt under the monolithic sealing gasket 50, the surface film 110 can be prevented from sticking to other external components (e.g., bottle caps).

[0030] <<Connecting Layer 200>> The connecting layer 200 is disposed between the upper layer 100 and the adhesive composite layer 300. Taking FIG. 1 as an example, the connecting layer 200 includes a connecting adhesive 210 and a coating area 220. The coating area 220 can be applied to a local area of ​​the lower surface of the upper layer 100, and the connecting layer 200 can bond the upper layer 100 and the adhesive composite layer 300 through the connecting adhesive 210. The structural configuration of the coating area 220 ensures that the coating structure (i.e., the structure above the coating area 220 in the connecting layer 200) and the adhesive composite layer 300 are bonded together but can be easily peeled off, so that the user can easily peel off the single-piece sealing gasket 50 by hand without the aid of external objects. In some embodiments, the monolithic sealing gasket 50 can achieve a peel strength greater than or equal to 17.8 N / 15 mm between the upper layer 100 and the adhesive-sealed composite layer 300 through the bonding adhesive 210, thereby firmly bonding the upper layer 100 and the adhesive-sealed composite layer 300. In some embodiments, the bonding adhesive 210 can be a bonding adhesive capable of achieving a peel strength greater than or equal to 17.8 N / 15 mm between the upper layer 100 and the adhesive-sealed composite layer 300, but is not limited thereto. In some embodiments, the bonding adhesive 210 can be a dry bonding adhesive, but is not limited thereto. In other embodiments, the bonding adhesive 210 can be a hot melt bonding adhesive, and the material of the hot melt bonding adhesive can be at least one selected from the group consisting of PE, PP, EMAC, EMAA, EAA, EEA, and EMMA. Furthermore, the thickness of the hot melt bonding adhesive is preferably 4 to 60 µm.

[0031] <<Adhesive-Sealing Composite Layer 300>> The adhesive-sealing composite layer 300 is disposed at the bottom of the monolithic sealing gasket 50. Taking Figure 1 as an example, the adhesive-sealing composite layer 300 includes, from top to bottom, an electromagnetic induction heating layer 310 and an adhesive layer 320. The electromagnetic induction heating layer 310 can be aluminum foil or a wireless information integrated sheet described later. Aluminum foil is a common structure in conventional sealing gaskets, and the thickness of the aluminum foil is preferably 10 to 40 µm, thereby enhancing the barrier function against moisture and oxygen, producing the effect of preventing leakage of contents and sealing and preserving the contents. Furthermore, in this invention, the wireless information integrated sheet described later can be used to replace the aluminum foil, which can effectively reduce the amount of aluminum foil used and reduce energy consumption. Specifically, the wireless information integration chip in this case can enhance wireless information transmission capabilities, reduce aluminum foil waste, lower energy consumption, avoid manpower waste, prevent interference from metals and liquids, improve production efficiency, provide excellent communication performance, and significantly extend communication distance, thereby greatly enhancing the automation, digitalization, and intelligence of factories, warehouses, logistics, stores, and unmanned checkout management. In some embodiments, the thickness of the wireless information integration chip is preferably 27µm to 2.5mm.

[0032] The sealing layer 320 is primarily used to seal the container opening. In some embodiments (e.g., Figure 1), the sealing layer 320 may be, for example, a hot melt adhesive. The hot melt adhesive may be made of at least one of the group consisting of EVA, PIB, EBA, EAA, EMAC, polyacrylate, acrylic copolymer, and EMAA, but is not limited thereto. Furthermore, the thickness of the hot melt adhesive is preferably 4 to 100 µm. With certain types of hot melt adhesives, adhesives can be eliminated, and a continuous sealing effect can be achieved even when the contents of the glass container contain water, and also when the contents of the glass container contain chili peppers, garlic, fermented bean curd, honey, or other pungent additives.

[0033] Furthermore, in another embodiment (e.g., Figures 2 and 3), taking Figure 2 as an example, the adhesive layer 320 may be a combination of an adhesive film 321 and an adhesive 322, and the adhesive 322 is disposed between the adhesive film 321 and the electromagnetic induction heating layer 310. In some embodiments, the material of the adhesive film 321 may be at least one selected from the group consisting of PE, PP, PA, PVDC, EVOH and PET, and the thickness of the adhesive film 321 is preferably 12 to 100 µm; while the adhesive 322 may be, for example, a composite adhesive, but is not limited thereto.

[0034] As described above, when the sealing layer 320 is a combination of hot melt adhesive or sealing film and adhesive, it makes it easier for the user to peel off the single-piece sealing gasket 50 from the bottle opening, or makes it easier for the user to peel off the clean single-piece sealing gasket 50 from the bottle opening.

[0035] Thus, the single-piece sealing gasket 50 shown in Figure 1 not only prevents leakage of the contents and deterioration due to external environmental influences, but also allows users to easily open the container opening by directly pinching the coating structure without the aid of external objects, thereby further achieving the function of easy opening. In other words, the single-piece sealing gasket 50 shown in Figure 1 can simultaneously ensure the airtightness of the contents and the convenience of opening for the user. Furthermore, since the single-piece sealing gasket 50 shown in Figure 1 does not require the configuration of a flap or unbonded area to achieve the function of easy opening, that is, omitting the flap structure and eliminating the need to retain space for unbonded areas, the configuration required for the single-piece sealing gasket 50 can be further reduced, thereby reducing the thickness of the single-piece sealing gasket 50.

[0036] In some embodiments, the cross-sectional width W1 of the local area coated on the lower surface of the upper layer 100 can be greater than or equal to one-sixth of the cross-sectional width W2 of the monolithic sealing gasket 50, and the cross-sectional width W1 of the local area coated on the lower surface of the upper layer 100 can be less than or equal to five-sixths of the cross-sectional width W2 of the monolithic sealing gasket 50, thereby allowing the manufacturer to adjust the coating range of the coating area 220 according to actual needs, thereby further increasing the manufacturer's design flexibility. In addition, when the cross-sectional width W2 of the monolithic sealing gasket 50 is relatively large, the cross-sectional width W1 of the local area coated on the lower surface of the upper layer 100 can be smaller; while when the cross-sectional width W2 of the monolithic sealing gasket 50 is relatively small, the cross-sectional width W1 of the local area coated on the lower surface of the upper layer 100 can be larger.

[0037] Furthermore, with respect to conventional sealing gaskets, as the gap between the upper layer 100 and the adhesive composite layer 300 becomes thinner, after electromagnetic induction sealing, the pull flap of the conventional sealing gasket tends to adhere to the film below it, making it difficult for the user to open the pull flap. In some embodiments, the material of the coating area 220 may be, for example, varnish or silicone oil, and the thickness of the coating area 220 is preferably 0.5 to 20 µm. Since the lower surface of the upper layer 100 is coated with varnish or silicone oil (i.e., coating area 220), the user can easily peel off the coating structure with their fingers, thereby ensuring that the user can easily peel off the single-piece sealing gasket 50 by directly pinching the coating structure without the aid of external objects.

[0038] Furthermore, in some embodiments, the coating method of the coating area 220 can be, for example, full-area coating or dot coating, so that the user can easily pry open the coating structure with their fingers, thereby ensuring that the user can easily peel off the single-piece sealing gasket 50 by directly pinching the coating structure without the aid of external objects. Taking the dot coating method as an example, after electromagnetic induction sealing, the small amount of air between the dot matrix of dot-coated varnish or silicone oil provided in this invention will be heated and expanded by electromagnetic induction sealing. This will cause the coating structure to be pushed upward, thereby ensuring that the coating structure and the adhesive composite layer 300 are separated from each other, so that the user can more easily pry open the coating structure with their fingers, thereby ensuring that the user can easily peel off the single-piece sealing gasket 50 by directly pinching the coating structure without the aid of external objects.

[0039] Please refer to FIG2, which is a cross-sectional schematic diagram illustrating the single-piece sealing gasket 50 of the second embodiment of this invention. More specifically, the adhesive composite layer 300 of the single-piece sealing gasket 50 shown in FIG2 further includes a bonding film 330 and a composite film 340. Since the other components are substantially the same as those of the single-piece sealing gasket 50 shown in FIG1, they will not be described again here.

[0040] <<Connecting Film 330>> The connecting film 330 is disposed above the electromagnetic induction heating layer 310. In other words, the connecting film 330 can be directly laminated above the electromagnetic induction heating layer 310, or it can be indirectly laminated above the electromagnetic induction heating layer 310 (i.e., other structures are disposed between the connecting film 330 and the electromagnetic induction heating layer 310). Taking Figure 2 as an example, the connecting film 330 is disposed on the uppermost layer of the adhesive composite layer 300, and it is used to laminate with the surface film 110 of the upper layer 100. More specifically, the connecting film 330 is laminated with the surface film 110 of the upper layer 100 through the adhesive 210. In some embodiments, the material of the bonding membrane 330 may be selected from at least one of the group consisting of PE, PP, PA, EPP and EPE, and the thickness of the bonding membrane 330 is preferably 12 to 200 µm; thereby, the peel strength between the bonding membrane 330 and the upper layer 100 after lamination can be improved.

[0041] <<Composite Film 340>> Taking Figure 2 as an example, the composite film 340 is disposed above the electromagnetic induction heating layer 310. More specifically, the composite film 340 is disposed between the connecting film 330 and the electromagnetic induction heating layer 310, and it is used to enhance the tensile strength of the monolithic sealing gasket 50. In some embodiments, the material of the composite film 340 may be at least one selected from the group consisting of PET, PA, PEN, PE and PP, and the thickness of the composite film 340 is preferably 12 to 100 µm.

[0042] Taking Figure 2 as an example, an adhesive 390 can be used to bond the connecting film 330 and the composite film 340, as well as the electromagnetic induction heating layer 310 and the composite film 340. In some embodiments, the adhesive 390 may be a composite adhesive that enables the peel strength between the two bonded layers (e.g., the connecting film 330 and the electromagnetic induction heating layer 310 or the electromagnetic induction heating layer 310 and the composite film 340) to be greater than or equal to 4 N / 15 mm, but is not limited thereto.

[0043] Please refer to FIG3, which is a cross-sectional schematic diagram illustrating the single-piece sealing gasket 50 of the third embodiment of this invention. More specifically, the upper layer 100 of the single-piece sealing gasket 50 shown in FIG3 further includes a first connecting film 150, and the adhesive composite layer 300 further includes a second connecting film 350 and a thickening layer 360. Since the other components are substantially the same as those of the single-piece sealing gasket 50 shown in FIG1, they will not be described again here.

[0044] <<First Connecting Film 150>> The first connecting film 150 is disposed below the surface film 110. In other words, the first connecting film 150 can be directly laminated below the surface film 110, or it can be indirectly laminated below the surface film 110 (i.e., other structures are disposed between the surface film 110 and the first connecting film 150). Taking FIG3 as an example, the first connecting film 150 is disposed at the bottom layer of the upper layer 100, and it is used to laminate with the adhesive composite layer 300. More specifically, the first connecting film 150 is laminated with the second connecting film 350 of the adhesive composite layer 300 through the adhesive 210. In some embodiments, the material of the first bonding membrane 150 may be selected from at least one of the group consisting of PE, PP, PA, EMMA and EMAC, and the thickness of the first bonding membrane 150 is preferably 12 to 100 µm; thereby, the peel strength between the first bonding membrane 150 and the second bonding membrane 350 of the adhesive composite layer 300 after lamination can be improved.

[0045] <<Second Connecting Film 350>> The second connecting film 350 is disposed above the electromagnetic induction heating layer 310. In other words, the second connecting film 350 can be directly laminated above the electromagnetic induction heating layer 310, or it can be indirectly laminated above the electromagnetic induction heating layer 310 (i.e., other structures are disposed between the second connecting film 350 and the electromagnetic induction heating layer 310). Taking Figure 3 as an example, the second connecting film 350 is disposed on the uppermost layer of the adhesive composite layer 300, which is used to laminate with the upper layer 100. More specifically, the second connecting film 350 is laminated with the first connecting film 150 of the upper layer 100 through the adhesive 210. In some embodiments, the material of the second bonding membrane 350 may be selected from at least one of the group consisting of PE, PP, PA, EPP and EPE, and the thickness of the second bonding membrane 350 is preferably 12 to 200 µm; thereby, the peel strength after the second bonding membrane 350 and the first bonding membrane 150 of the upper layer 100 are bonded together can be improved.

[0046] <<Thickening Layer 360>> Taking Figure 3 as an example, the thickening layer 360 is disposed above the electromagnetic induction heating layer 310 (specifically, it may be located between the second connecting film 350 and the electromagnetic induction heating layer 310), and it is used to increase the thickness of the monolithic sealing gasket 50. In some embodiments, the material of the thickening layer 360 may be at least one selected from the group consisting of EPE, EPP, PE, PP and paper, and the thickness of the thickening layer 360 is preferably 60 to 3000 µm; thereby, the thickness of the monolithic sealing gasket 50 can be increased.

[0047] Taking Figure 3 as an example, an adhesive 390 can be used to bond the second connecting film 350 and the thickening layer 360, as well as the thickening layer 360 and the electromagnetic induction heating layer 310. In some embodiments, the adhesive 390 may be a composite adhesive that enables the peel strength between the two bonded layers (e.g., the second connecting film 350 and the thickening layer 360 or the thickening layer 360 and the electromagnetic induction heating layer 310) to be greater than or equal to 4 N / 15 mm, but is not limited thereto.

[0048] Furthermore, an adhesive 190 may be used to bond the surface film 110 and the first connecting film 150 together. In some embodiments, the adhesive 190 may be a composite adhesive that enables the peel strength between the two bonded layers (e.g., the surface film 110 and the first connecting film 150) to be greater than or equal to 4 N / 15 mm, but is not limited thereto.

[0049] Please refer to Figures 4A and 4B, which are side views illustrating the single-piece sealing gasket 50 of this invention. More specifically, Figure 4A illustrates an embodiment in which the cross-sectional width of a local area (i.e., coating area 220) coated on the lower surface of the upper layer 100 is equal to one-sixth of the cross-sectional width of the single-piece sealing gasket; and Figure 4B illustrates an embodiment in which the cross-sectional width of a local area (i.e., coating area 220) coated on the lower surface of the upper layer 100 is equal to five-sixths of the cross-sectional width of the single-piece sealing gasket.

[0050] [Wireless Information Integration Chip] Next, the wireless information integration chip that can be used in this case will be described.

[0051] First, please refer to FIG5, which is a cross-sectional schematic diagram illustrating the wireless information integration sheet 100w of the first embodiment of this invention. As shown in FIG5, the wireless information integration sheet 100w may include a base film 1w, a first adhesive layer 2w, and an information and heating layer 3w. The first adhesive layer 2w is located between the base film 1w and the information and heating layer 3w to bond the base film 1w and the information and heating layer 3w. The various structures will be described in more detail below.

[0052] The base film 1w is the initial layer used to fabricate the wireless information integration sheet. In one specific example, the material of the base film 1w can be at least one selected from the group consisting of polyimide (PI), PEN, PET, polycarbonate (PC), PP, and PE. Furthermore, the thickness of the base film 1w is preferably 20 to 150 µm, within which longitudinal tensile strength is greater. In addition, as shown in FIG. 5, the lower surface of the base film 1w is bonded to the first adhesive layer 2w, while the upper surface of the base film 1w can serve as a printing surface for printing different patterns.

[0053] The first adhesive layer 2w is a layer used to bond the base film and information to the heating layer. In one specific example, the first adhesive layer 2w only needs to be able to bond the base film 1w and information to the heating layer 3w, and its material can be, for example, a composite adhesive. Furthermore, the thickness of the first adhesive layer 2w can be 0.5 to 7 µm, which can make the peel strength between the two bonded materials greater than 4 N / 15 mm.

[0054] Taking Figure 5 as an example, the information and heating layer 3w includes an information area 31w and an electromagnetic induction heating ring 32w. The information area 31w has the function of wireless information read and write transmission, so as to facilitate subsequent product traceability. Among them, the information area 31w has an antenna 312w and a chip 311w that are interconnected. Furthermore, the electromagnetic induction heating ring 32w can be heated by electromagnetic induction through the electromagnetic field generated by the electromagnetic induction sealing machine, so that the adhesive layer of the sealing gasket is heated and melted and adhered to the container opening, thereby acting as an electromagnetic induction sealing gasket to seal the container opening. With the wireless information integrated chip included in this case, most of the heat can be generated in the electromagnetic induction heating ring 32w, and very little heat is conducted only in at least one physical connection bridge 33w between the antenna 312w and the electromagnetic induction heating ring 32w. The physical connecting bridge 33w can have a length of 0.1 to 3 mm and a width of 0.01 to 5 mm. The material of the physical connecting bridge 33w can be the same as that of the antenna 312w. This prevents excessive heat transfer to the central area of ​​the sealing gasket during electromagnetic induction sealing, thus saving energy. Furthermore, when applied to sealing gaskets containing batteries, the thickness of the information and heating layer 3w can be 6 µm to 2.5 mm; while when applied to sealing gaskets without batteries, the thickness of the information and heating layer 3w can be 6 to 300 µm.

[0055] Next, Figure 6A is a plan view illustrating a specific example of the information and heating layer 3w in this case, and Figure 6B is a plan view illustrating another specific example of the information and heating layer 3w in this case. As shown in Figure 6A or Figure 6B, the electromagnetic induction heating ring 32w surrounds the information area 31w in a planar view. Furthermore, as shown in Figure 6A, the electromagnetic induction heating ring 32w and the information area 31w are filled with an ITV (interval spacer), meaning there are no physical connecting elements (e.g., physical connecting bridges described later) between the electromagnetic induction heating ring 32w and the information area 31w. Therefore, by filling the spacer ITV between the electromagnetic induction heating ring 32w and the information area 31w, this filled spacer ITV can block heat conduction to the information area 31w when electromagnetic induction heating occurs, which is a preferred configuration. Furthermore, the ITV (the distance between the outermost edge of the information area 31w and the innermost edge of the electromagnetic induction heating ring 32w) can be 0.1 to 3 mm. Next, as shown in Figure 6B, a gap ITV is provided at most of the location between the electromagnetic induction heating ring 32w and the information area 31w. This gap ITV can block most of the heat conduction to the information area 31w when electromagnetic induction heating occurs, and the gap ITV (the distance between the outermost edge of the information area 31w and the innermost edge of the electromagnetic induction heating ring 32w) can be 0.1 to 3 mm. In addition, there can be at least one physical connection bridge 33w (two are indicated in Figure 6B and Figure 7B described later) between the antenna 312w and the electromagnetic induction heating ring 32w. The length of the physical connection bridge 33w can be 0.1 to 3 mm, and the width of the physical connection bridge 33w can be 0.01 to 5 mm. At this time, although the closed-loop electromagnetic induction heating ring 32w and the information area 31w are electrically connected, the wireless communication distance is not reduced much. In other words, the space between the electromagnetic induction heating ring 32w and the information area 31w can be filled with a spacer ITV, and can have both a spacer ITV and a physical connection bridge 33w at the same time, or it can be without a spacer (for example, the space between the electromagnetic induction heating ring 32w and the information area 31w can be filled with a physical connection bridge 33w).

[0056] In one specific example, the material of the electromagnetic induction heating ring 32w may be a metal, such as aluminum, copper, gold, silver, or tin, but is not limited thereto. Furthermore, from the viewpoint of the effect of generating heat when subjected to a changing electromagnetic field and cost, the electromagnetic induction heating ring 32w is preferably made of aluminum foil, and its thickness is preferably 6 to 40 µm.

[0057] Next, Figure 7A is a plan view illustrating a specific example of the information area of ​​this invention, and Figure 7B is a plan view illustrating another specific example of the information area of ​​this invention. Figure 7A shows an embodiment where the space between the electromagnetic induction heating ring 32w and the information area 31w in Figure 6A is filled with spaced ITVs, and Figure 7B shows an embodiment where most of the space between the electromagnetic induction heating ring 32w and the information area 31w in Figure 6B is filled with spaced ITVs. Furthermore, as shown in Figure 7A or Figure 7B, the information area 31w includes a chip 311w and an antenna 312w. Moreover, when wireless information transmission functionality is achieved, the chip 311w and the antenna 312w can be arranged in the manner shown in Figure 7A or Figure 7B, or in other ways, based on the RFID frequency band desired by the user, without particular limitation.

[0058] On the other hand, regarding the chip 311w, it may have a unique identification code and can be selected according to the purpose. For example, it may be a radio frequency identification near field communication (RFID_NFC) chip, a radio frequency identification high frequency (RFID_HF) chip, a radio frequency identification ultra-high frequency (RFID_UHF) chip, or a radio frequency identification microwave (RFID_MW) chip, etc., without particular limitation. All of these chips can be matched with the antenna 312w described later to realize wireless information communication functions.

[0059] Next, regarding the antenna 312w, its main function is to generate wirelessly transmitted signals. Its material can be metal, such as copper, silver, gold, tin or aluminum, etc., without any particular limitation.

[0060] In addition, although Figure 5 shows the case where the base film 1w is on top and the information and heating layer 3w is on the bottom, the order of the base film 1w and the information and heating layer 3w can be reversed as needed, that is, adjusted to the case where the base film 1w is on the bottom and the information and heating layer 3w is on top.

[0061] Alternatively, the wireless information integration sheet can also be a wireless information integration sheet 100w', which, as shown in FIG8, includes, in addition to the aforementioned base film 1w, first adhesive layer 2w, and information and heating layer 3w, a protective layer 5w and a second adhesive layer 4w. The protective layer 5w is located on the side of the information and heating layer 3w away from the base film 1w. Furthermore, the second adhesive layer 4w is located between the information and heating layer 3w and the protective layer 5w, and is used to bond the information and heating layer 3w and the protective layer 5w.

[0062] In one specific example, the second adhesive layer 4w only needs to be able to bond the information layer to the heating layer 3w and the protective layer 5w, and its material can be, for example, a dry composite adhesive, without particular limitation. Furthermore, the thickness of the second adhesive layer 4w can be 0.5 to 7 µm, preferably such that the peel strength between the two bonded layers is greater than 4 N / 15 mm. In addition, as shown in FIG8, the second adhesive layer 4w can extend to fill the gap between the electromagnetic induction heating ring 32w and the information area 31w to improve the overall structural strength of the wireless information integrated chip 100w'.

[0063] Next, the protective layer 5w will be described. The protective layer 5w is used to protect the information area 31w (i.e., the chip 311w, the antenna 312w, and the optional battery) from external damage to the chip 311w and the battery, thereby affecting their ability to transmit wireless information. The material of the protective layer 5w can be at least one selected from the group consisting of polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyamide (PA), polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), polyethylene naphthalate (PEN), and polyimide (PI). Furthermore, in a preferred embodiment, the thickness of the protective layer 5w can be 12 to 100 µm.

[0064] Furthermore, either the upper or lower surface of the protective layer 5w can be used as the printing surface. Therefore, although Figure 8 shows the case where the base film 1w is on the bottom and the protective layer 5w is on the top (the upper surface of the protective layer 5w is used as the printing surface), the order of the base film 1w and the protective layer 5w can be reversed as needed, that is, the case where the base film 1w is on the top and the protective layer 5w is on the bottom (the lower surface of the protective layer 5w is used as the printing surface).

[0065] [Making of a single-piece sealing gasket (I)] Based on the following steps, a single-piece sealing gasket 50 as shown in Figure 2 is made.

[0066] First, an adhesive is applied to the lower surface of the composite film roll, so that the lower surface of the composite film roll is dry-laminated with the electromagnetic induction heating layer roll, and then placed in a curing chamber for more than 24 hours to produce the first composite roll.

[0067] Next, varnish or silicone oil is applied to a local area on the lower surface of the surface film roll in a full-coverage manner to create a functional layer roll.

[0068] Next, an adhesive is applied to the upper surface of the first composite roll, and the upper surface of the first composite roll is dry-laminated with the connecting film roll. The roll is then placed in a curing chamber for more than 24 hours to produce the second composite roll.

[0069] Next, an adhesive is applied to the electromagnetic induction heating layer of the second composite roll, and the electromagnetic induction heating layer of the second composite roll is dry-laminated with the sealing film roll. The mixture is then placed in a curing chamber for at least 24 hours to produce the lower composite roll. Alternatively, hot melt adhesive is applied to the composite film surface of the second composite roll to produce the lower composite roll.

[0070] Next, an adhesive is applied to the bonding film surface of the lower composite roll material, so that the bonding film surface of the lower composite roll material is dry-laminated with the lower surface of the functional layer roll material, and then placed in a curing chamber for more than 24 hours to produce a single-piece sealing gasket roll material. After that, single-piece sealing gaskets of appropriate size are cut according to the user's needs.

[0071] [Making of a single-piece sealing gasket (II)] Based on the following steps, a single-piece sealing gasket 50 as shown in Figure 3 is made.

[0072] First, an adhesive is applied to the lower surface of the surface film roll, so that the lower surface of the surface film roll is dry-laminated with the first connecting film roll, and then placed in a curing chamber for more than 24 hours to produce the upper composite roll.

[0073] Next, varnish or silicone oil is applied to a local area of ​​the first connecting film surface of the upper composite section roll in a full-coverage manner to create a functional layer roll.

[0074] Next, an adhesive is applied to the upper surface of the electromagnetic induction heating layer roll material, so that the upper surface of the electromagnetic induction heating layer roll material is dry-laminated with the thickened layer roll material, and the material is placed in a curing chamber for more than 24 hours to produce the first composite roll material.

[0075] Next, an adhesive is applied to the thickened layer of the first composite roll, and the thickened layer of the first composite roll is dry-laminated with the second connecting film roll. The roll is then placed in a curing chamber for more than 24 hours to produce the second composite roll.

[0076] Next, an adhesive is applied to the electromagnetic induction heating layer of the second composite roll, and the electromagnetic induction heating layer of the second composite roll is dry-laminated with the sealing film roll. The roll is then placed in a curing chamber for at least 24 hours to produce the lower composite roll. Alternatively, hot melt adhesive is applied to the electromagnetic induction heating layer of the second composite roll to produce the lower composite roll.

[0077] Next, an adhesive is applied to the second connecting film surface of the lower composite roll material, so that the second connecting film surface of the lower composite roll material is dry-laminated with the lower surface of the functional layer roll material, and then placed in a curing chamber for more than 24 hours to produce a single-piece sealing gasket roll material. After that, single-piece sealing gaskets of appropriate size are cut according to the user's needs.

[0078] In the production of the above-mentioned single-piece sealing gaskets (a) and (b), the local area is between one-sixth and five-sixths of the cross-sectional width of the single-piece sealing gasket. Furthermore, the peel strength between the two layers of material bonded by the adhesive is greater than or equal to 4 N / 15 mm; while the peel strength between the two layers of material bonded by the bonding adhesive is greater than or equal to 17.8 N / 15 mm. The temperatures of the five sections of the upper drying tunnel of the dry laminating machine are 60 to 65°C, 65 to 70°C, 70 to 75°C, 75 to 80°C, and 80 to 85°C, respectively. The temperature of the laminating roller of the dry laminating machine is 50 to 60°C. The temperature of the curing chamber is 50 to 55°C.

[0079] [Preparation of Wireless Information Integration Sheet Roll Material] Based on the following steps, a preferred embodiment of the present invention, the wireless information integration sheet roll material, is prepared. The wireless information integration sheet roll material described herein can be used as an embodiment of the aforementioned electromagnetic induction heating layer roll material in the process of preparing the aforementioned single-piece sealing gasket roll material.

[0080] First, a composite adhesive (first adhesive layer) is applied to the composite surface of the base film roll, and then it is laminated with the composite surface of the metal foil roll to form a wireless information integrated circuit preform roll. Next, the metal foil of the wireless information integrated circuit preform roll is etched to connect the antenna and the chip to form an electrical connection. Then, a chip encapsulation protective adhesive is used to encapsulate the chip and the connecting wires connecting the chip and the antenna. At this point, the metal foil of the wireless information integrated circuit preform roll forms an information and heating layer, and the wireless information integrated circuit preform roll becomes a wireless information integrated circuit roll.

[0081] The peel strength between the two layers of materials bonded by the composite adhesive is greater than 4N / 15mm.

[0082] In addition, if it is desired to add a battery to the information and heating layer, a welding machine or conductive adhesive can be used to process the battery cell and the chip into an electrical connection.

[0083] On the other hand, based on the aforementioned wireless information integrated sheet roll, a dry composite adhesive (second adhesive layer) is applied to the composite surface of the protective layer roll, and the information and heating layer surface (the surface away from the base film) of the wireless information integrated sheet roll roll is dry-laminated, and then cured in a curing chamber for more than 24 hours to produce another embodiment of the wireless information integrated sheet roll roll.

[0084] It should be noted that the above description is merely an illustrative example of how to manufacture the single-piece sealing gasket 50 of this application. That is to say, those skilled in the art to which this application pertains can also adjust the order to manufacture the single-piece sealing gasket 50 of this application.

[0085] This application is not limited to the various embodiments described above. Those skilled in the art to which this application pertains can make various additions, subtractions, substitutions and / or changes within the scope disclosed in the claims. Furthermore, embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included within the technical scope of this application. [Simplified Explanation of the Diagram]

[0024] Figure 1 is a cross-sectional schematic diagram illustrating the single-piece sealing gasket of the first embodiment of this invention. Figure 2 is a cross-sectional schematic diagram illustrating the single-piece sealing gasket of the second embodiment of this invention. Figure 3 is a cross-sectional schematic diagram illustrating the single-piece sealing gasket of the third embodiment of this invention. Figures 4A to 4B are side views illustrating the single-piece sealing gasket of this invention. Figure 5 is a cross-sectional schematic diagram illustrating the wireless information integration sheet of the first embodiment of this invention. Figure 6A is a plan view illustrating a specific example of the information and heating layer of this invention. Figure 6B is a plan view illustrating another specific example of the information and heating layer of this invention. Figure 7A is a plan view illustrating a specific example of the information area of ​​this invention. Figure 7B is a plan view illustrating another specific example of the information area of ​​this invention. Figure 8 is a cross-sectional schematic diagram illustrating the wireless information integration sheet of the second embodiment of this invention.

Claims

1. A single-piece sealing gasket, comprising, from top to bottom: an upper layer including a surface film; a bonding layer including a bonding adhesive and a coating area; and an adhesive-sealing composite layer, comprising, from top to bottom, an electromagnetic induction heating layer and an adhesive-sealing layer; wherein, The coating area is a localized region on the lower surface of the upper layer, and the bonding layer is used to bond the upper layer to the adhesive composite layer via the adhesive. The electromagnetic induction heating layer is a wireless information integrated chip, which includes: a base film; an information and heating layer including an information area and an electromagnetic induction heating ring; and a first adhesive layer located between the base film and the information and heating layer. The information area has an interconnected antenna and a chip, and the electromagnetic induction heating ring surrounds the information area in a planar view. There is a gap between the electromagnetic induction heating ring and the information area.

2. The single-piece sealing gasket as described in claim 1, wherein, The cross-sectional width of the local area is greater than or equal to one-sixth of the cross-sectional width of the single-piece sealing gasket, and the cross-sectional width of the local area is less than or equal to five-sixths of the cross-sectional width of the single-piece sealing gasket.

3. The single-piece sealing gasket as described in claim 1, wherein, The coating material in this area is either varnish or silicone oil.

4. The single-piece sealing gasket as described in claim 1, wherein, The coating method for this coating area is either full-area coating or dot coating.

5. The single-piece sealing gasket as described in claim 1, wherein, The adhesive composite layer further includes: a bonding membrane disposed above the electromagnetic induction heating layer; wherein the bonding membrane is made of at least one material selected from the group consisting of polyethylene (PE), polypropylene (PP), polyamide (PA), expandable polypropylene (EPP), and expandable polyethylene (EPE).

6. The single-piece sealing gasket as described in claim 1, wherein, The adhesive composite layer further comprises: a composite film disposed above the electromagnetic induction heating layer; wherein the composite film is made of at least one of the group consisting of polyethylene terephthalate (PET), PA, polyethylene naphthalate (PEN), PE and PP.

7. A single-piece sealing gasket as described in any one of claims 1 to 6, wherein, The material of the surface film is selected from at least one of the group consisting of PP, PET, PE, PA and ethylene-methyl acrylate copolymer (EMAC).

8. The single-piece sealing gasket as described in any one of claims 1 to 6, wherein, The sealing layer is a combination of hot melt adhesive or sealing film and adhesive. The hot melt adhesive is made of at least one material selected from the group consisting of ethylene / vinyl acetate copolymer (EVA), polyisobutylene (PIB), ethylene butyl acrylate copolymer (EBA), ethylene acrylate copolymer (EAA), EMAC, polyacrylate, acrylic copolymer, and ethylene methacrylic acid copolymer (EMAA). The sealing film is made of at least one material selected from the group consisting of PE, PP, PA, polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), and PET. The adhesive is disposed between the sealing film and the electromagnetic induction heating layer.

9. A single-piece sealing gasket as described in any one of claims 1 to 6, wherein, The adhesive is a dry composite adhesive or a hot melt laminate, and the material of the hot melt laminate is selected from at least one of the group consisting of PE, PP, EMAC, EMAA, EAA, ethylene ethyl acrylate copolymer (EEA) and ethylene methyl methacrylate copolymer (EMMA).

10. The single-piece sealing gasket as described in any one of claims 1 to 6, wherein, The adhesive provides a peel strength between the upper layer and the adhesive composite layer that is greater than or equal to 17.8 N / 15 mm.

11. The single-piece sealing gasket as described in claim 1, wherein, The wireless information integrated chip also includes a protective layer and a second adhesive layer. The protective layer is located on the side of the information and heating layer away from the base film, and the second adhesive layer is located between the information and heating layer and the protective layer.

12. The single-piece sealing gasket as described in claim 1, wherein, The interval is the distance between the outermost edge of the information area and the innermost edge of the electromagnetic induction heating ring, which is 0.1 mm to 3 mm.

13. The single-piece sealing gasket as described in claim 1, wherein, The electromagnetic induction heating ring is completely separated from the information area.

14. The single-piece sealing gasket as described in claim 1, wherein, The information and heating layer also includes at least one physical connection bridge, which is used to connect the information area and the electromagnetic induction heating ring.