Manufacturing method of the joint, manufacturing method of the joint and device, and resin composition

Abstract

This invention provides a method for manufacturing a bonding body, a method for manufacturing a bonding body, a device, and a resin composition. The method for manufacturing the bonding body includes: a process for preparing a substrate A, wherein the substrate A has a surface having an electrode A; an organic insulating portion forming process for forming an organic insulating portion on the surface having the electrode A; a process for preparing a substrate B, wherein the substrate B has a surface having an electrode B; and a bonding process for bonding the surface having the organic insulating portion of the substrate A to the surface having the electrode B of the substrate B. The organic insulating portion forming process includes: applying a resin composition to the surface having the electrode A of the substrate A to form a film with a thickness of 1.5 times or more relative to the height of the electrode A; and a removal process for reducing the film thickness by using an organic solvent.