Polyimide materials for glass substrate modification

Abstract

The present invention provides a polyimide precursor composition, which comprises an amic acid ester oligomer having the structure of formula (I): , wherein G, R xand n are as defined herein, and each P is independently a divalent group, wherein based on the total mole of all divalent organic groups P in the composition, about 1 mol% to about 20 mol% of the divalent organic groups P are a diamine residue having a group(s) selected from a nitrogen-containing heteroaromatic ring containing at least two nitrogens, an aromatic ring or heterocyclic ring containing at least two -COOH groups, and a combination thereof, and about 0.5 mol% to about 40 mol% of the divalent organic groups P are , wherein R 1, R 2, R 3, R 4, R 5, R 6and m are as defined herein.