Resin composition, cured material, laminate, manufacturing method of cured material, manufacturing method of laminate, manufacturing method of semiconductor device, semiconductor device and resin

Abstract

A resin composition, a cured product formed by curing the above composition and a method for manufacturing the same, a laminate containing the cured product and a method for manufacturing the same, a semiconductor element and a method for manufacturing the same, and a novel resin, wherein the resin composition contains a resin and a photopolymerization initiator, the resin being a polyimide or a polyimide precursor and having a polymerizable group and a structure represented by the following formula (A-1).