Resin composition, article made therefrom, and use thereof
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO LTD
- Filing Date
- 2025-02-24
- Publication Date
- 2026-07-16
Abstract
Claims
1. A resin composition, characterized in that the resin composition comprises the following components: 100 parts by weight of a thermosetting resin and 100 to 300 parts by weight of an inorganic filler; the volatile organic matter content of the resin composition, as measured according to IPC-TM-650 2.4.24.6, is less than or equal to 2.0%; the shear viscosity change rate of the resin composition, as measured according to GB / T 2794-2022 7.3, is 9 to 56%; and the dielectric loss coefficient of the cured resin obtained by curing the resin composition, as measured according to JIS C2565 at a frequency of 10 GHz, is less than or equal to 0.0080.
2. The resin composition as claimed in claim 1, characterized in that the volatile organic matter content of the resin composition, as measured according to the method of IPC-TM-650 2.4.24.6, is less than or equal to 0.5%, and the dielectric loss coefficient of the cured resin obtained by curing the resin composition, as measured according to the method of JIS C2565 at a frequency of 10 GHz, is less than or equal to 0.0041.
3. The resin composition as claimed in claim 1, characterized in that, based on a total mass of 100 wt% of the inorganic filler, the inorganic filler comprises 50 to 100 wt% silicon dioxide.
4. The resin composition as claimed in claim 1, characterized in that, based on a total inorganic filler mass of 100 wt%, the inorganic filler comprises 2 to 17 wt% surface-porous silica.
5. The resin composition as claimed in claim 4, characterized in that the specific surface area of the porous silica is 40~200 m² / g.
6. The resin composition as claimed in claim 4, characterized in that the specific surface area of the porous silica is 103~200 m² / g.
7. The resin composition as claimed in claim 1, characterized in that the thermosetting resin comprises any one or a combination thereof of polyolefins, acrylate compounds, maleimide resins, organosilicone resins, polyphenylene ether resins, benzo[a]pyrene resins, epoxy resins, reactive esters, phenolic resins, and cyanate ester resins.
8. The resin composition as claimed in claim 1, characterized in that the resin composition does not contain organic solvents.
9. The resin composition of claim 1, characterized in that the thermosetting resin comprises (A) maleic anhydride-modified polyolefin and (B) a polyfunctional (meth)acrylate monomer and / or its oligomer; and the inorganic filler comprises (C) surface-porous silica and (D) non-porous silica.
10. The resin composition as claimed in claim 9, characterized in that the mass ratio of (A) maleic anhydride modified polyolefin: (B) polyfunctional (meth)acrylate monomer and / or its oligomer: (C) surface porous silica: (D) nonporous silica is 100: (30~90): (10~30): (150~350).
11. The resin composition as claimed in claim 9, characterized in that the mass ratio of the (C) surface porous silica to the (D) non-porous silica is (1:5) to (1:35).
12. The resin composition of claim 1, characterized in that the resin composition further comprises any one or a combination of a flame retardant, a curing accelerator, a polymerization inhibitor, a colorant, a surfactant, and a toughening agent.
13. An article made from a resin composition as claimed in any one of claims 1 to 12, characterized in that the article comprises a prepreg, a resin film, a laminate, or a printed circuit board.
14. An article made from a resin composition as claimed in any one of claims 1 to 12, characterized in that the article comprises a cured resin product obtained by curing the resin composition.
15. A printed circuit board manufactured by using the resin composition of any one of claims 1 to 12 in a resin filling process for a printed circuit board, characterized in that the printed circuit board has one or more of the following characteristics: the rate of tin drift cracking in the resin cured area of the printed circuit board, as measured according to the method of IPC-TM-650 2.4.13.1, is 0%; the impedance amplitude of the resin cured area of the printed circuit board, as measured using a network analyzer, is less than or equal to 10%; and the continuous scraping time in the resin filling process of the printed circuit board is greater than or equal to 15 minutes.
16. Use of a resin composition as claimed in any one of claims 1 to 12 in a resin filling process for printed circuit boards.
17. The use as claimed in claim 16, characterized in that the printed circuit board resin filling process includes one or more of the following: printed circuit board via filling process, printed circuit board slot filling process, or printed circuit board circuit filling process.
18. The use as claimed in claim 17, characterized in that, in the printed circuit board via filling process, at least one hole of the printed circuit board is filled with a cured resin composition; and / or, in the printed circuit board groove filling process, at least one groove of the printed circuit board is filled with a cured resin composition; and / or, in the printed circuit board circuit filling process, at least one circuit void area of the printed circuit board is covered with a cured resin composition.