Epoxy resin composition for semiconductor sealing and semiconductor devices using the same

Abstract

This invention relates to an epoxy resin composition for semiconductor sealing, characterized by comprising the following components (A) to (D): (A) an epoxy resin as shown in general formula (1): (1); (B) a phenolic curing agent; (C) an inorganic filler; (D) an organosilicone compound comprising the following (D1) and (D2): (D1) an epoxy-containing organosilicone compound selected from one or more organooxysilanes and their hydrolysates as shown in general formula (2): (2); (D2) an organosilicone compound as shown in general formula (3) and having S-Si bonds: (3). Accordingly, a semiconductor sealing resin composition is provided that imparts good electrical insulation at high temperatures, high adhesion to copper, silver, organic primers, etc., and less peeling after solder reflow, and a semiconductor device is used to seal the cured product using the semiconductor sealing resin composition.

Images