Prepolymer, resin composition including the same and article made therefrom
TW202629702AActive Publication Date: 2026-07-16ELITE ELECTRONIC MATERIAL (KUNSHAN) CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- ELITE ELECTRONIC MATERIAL (KUNSHAN) CO LTD
- Filing Date
- 2025-02-26
- Publication Date
- 2026-07-16
Abstract
The present disclosure provides a prepolymer, resin composition including the same and article made therefrom. The prepolymer is obtained from a mixture through prepolymerization. The mixture includes (a) maleimide resin, (b) epoxy-modified cyclic siloxane, and (c) an active hydrogen-containing compound. The active hydrogen-containing compound includes amino siloxane, diallyl bisphenol, or a combination thereof. The prepolymer and resin composition including the same of the present disclosure may have significant improvements in one or more of the properties including X-CTE uniformity of the article, copper foil peeling strength after copper plating, dimension stability after solder floating, and heterogeneous resin flow length.
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