Prepolymer, resin composition including the same and article made therefrom

TW202629702AActive Publication Date: 2026-07-16ELITE ELECTRONIC MATERIAL (KUNSHAN) CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
ELITE ELECTRONIC MATERIAL (KUNSHAN) CO LTD
Filing Date
2025-02-26
Publication Date
2026-07-16
Patent Text Reader

Abstract

The present disclosure provides a prepolymer, resin composition including the same and article made therefrom. The prepolymer is obtained from a mixture through prepolymerization. The mixture includes (a) maleimide resin, (b) epoxy-modified cyclic siloxane, and (c) an active hydrogen-containing compound. The active hydrogen-containing compound includes amino siloxane, diallyl bisphenol, or a combination thereof. The prepolymer and resin composition including the same of the present disclosure may have significant improvements in one or more of the properties including X-CTE uniformity of the article, copper foil peeling strength after copper plating, dimension stability after solder floating, and heterogeneous resin flow length.
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