Thermally conductive composition, thermally conductive gel, and use thereof

TW202629707APending Publication Date: 2026-07-16HENKEL KGAA

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Patent Information

Application Number: TW114124807
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Filing Date: 2025-07-01
Publication Date: 2026-07-16

Application Information

Patent Timeline

01 Jul 2025

Application

TW114124807

16 Jul 2026

Publication

TW202629707A

IPC: C08L83/07; C08K3/22; C08K5/053; C08K9/06; C08L83/05; C09K5/14

Inventors: 李永明; 劉海洋

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Abstract

The present invention discloses a novel thermally conductive composition, a thermally conductive gel cured therefrom, a process for preparing the thermally conductive gel, an article comprising the thermally conductive gel, and uses thereof. The thermally conductive gel cured from the thermally conductive composition of the present invention exhibits excellent gap stability and dispensing performance, while maintaining good flowability and thermal conductivity.

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