Methods for inspecting adhesive tape and components, and methods for manufacturing components using adhesive tape.

Abstract

An adhesive tape is provided that, after electronic components are cut into tiny sizes, allows for visual inspection of the quality of all wafer facets by bending the tape, and then the tiny electronic components can be peeled off simply by stretching. Furthermore, the present invention provides a method for manufacturing components using the aforementioned adhesive tape. The adhesive tape of the present invention has an adhesive layer on at least one surface of a substrate, wherein the S25·T obtained by multiplying the 25% modulus S25 (MPa) of the substrate by the thickness T (μm) of the substrate is greater than 75 and less than 5000 (MPa·μm), the thickness of the substrate is less than 500 μm, and the absolute value of the difference between the 25% modulus and the 300% modulus of the adhesive layer is 0.5 MPa or more.