Wafer cleaning solution and cleaning method

TW202629769APending Publication Date: 2026-07-16ZING SEMICON CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
ZING SEMICON CORP
Filing Date
2025-09-16
Publication Date
2026-07-16

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    Figure TWG2TA001068560_002
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    Figure TWG2TA001068560_003
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Abstract

The present application provides a wafer cleaning solution and a wafer cleaning method. The cleaning solution is used in SC-2 clean and comprises hydrochloric acid, hydrogen peroxide, and deionized water, wherein the cleaning solution has a pH of more than
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