Substrate clamps and substrate clamping methods

Abstract

This disclosure provides a substrate clamp and a substrate clamping method. The substrate clamp is used to clamp a substrate and includes: a clamping plate configured to enclose a clamping space; a sealing member for forming a seal between the substrate and the clamping plate when the substrate is clamped; a pressure plate for pressing down on the back side of the substrate to make the substrate press against the sealing member; and a pressure plate lifting assembly for driving the pressure plate to lift and lower. The pressure plate has an air groove, a support portion, and an outer periphery. The air groove and the support portion are located inside the outer periphery. The air groove is configured to connect to an air extraction device to create a negative pressure between the pressure plate and the substrate when the air extraction device extracts air from the air groove, thereby flattening the substrate. The bottom of the support portion is flush with the bottom of the outer periphery and is used to contact and support the back side of the substrate.

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