Method and showerhead for substrate processing

TW202629825APending Publication Date: 2026-07-16LAM RES CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
LAM RES CORP
Filing Date
2021-11-29
Publication Date
2026-07-16

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Abstract

A bow compensation layer deposited on a backside of a bowed semiconductor substrate may modulate stress to mitigate asymmetric bowing. In some implementations, the bow compensation layer may be formed by varying precursor concentration adjacent to the backside according to a non-linear mass flow profile along the bowed semiconductor substrate. Precursor flow may be varied in a manner to match or substantially match a parabolic or polynomial function. In some implementations, a showerhead pedestal may vary precursor flow along the bowed semiconductor substrate, where the showerhead pedestal is divided into multiple zones for delivering a first gas to a first zone of a plenum volume and a second gas to a second zone of the plenum volume.
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