Primer resin liquid for electroless plating, plating method for glass substrates with through-hole using the primer resin liquid, and glass interposer substrates

Abstract

A primer resin liquid for electroless plating composed of resin components and a solvent component, including resin I as a primary component, resin II as a crosslinker component, and resin III as an adhesive component. The resin III is a thermosetting resin with a bisphenol skeleton, and the content of the resin III in the resin components is 10% by mass or more and 48% by mass or less. The viscosity and surface tension of the primer resin liquid are optimized to form a primer resin layer on substrates with a through-hole. Specifically, the primer resin liquid of the present invention has a viscosity of 10 mPa·s or less at 25°C and a surface tension of 40 mN / m or less at 22°C, as measured by the Young-Laplace method. This allows for the formation of a primer resin layer for forming a metal film on glass substrates, such as TGV, while maintaining adhesion.