Independent anode chamber, electroplating tank device and electroplating solution supply method

Abstract

This invention provides an independent anode chamber, an electroplating tank device, and a method for supplying electroplating solution. The independent anode chamber includes an anode chamber body and an anode plate assembly. The anode chamber body has a flat structure and a flat inner cavity for placing the anode plate assembly and holding the anode electroplating solution. An ion exchange membrane is installed at a side opening of the anode chamber body. The anode plate assembly includes an anode plate, a base plate, and a conductive sheet. The base plate is vertically installed in the flat inner cavity of the anode chamber body, with the anode plate facing the ion exchange membrane. The inner cavity volume of the anode chamber of this invention is significantly reduced compared to the anode cavity volume of the integrated electroplating tank in the prior art, thus saving the amount of anode electroplating solution used. The anode chamber adopts an independent structure and can be detached from the electroplating tank, facilitating the maintenance and operation of the anode chamber. When using spare anode chambers, maintenance can be performed without shutting down the system.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging wet process technology, specifically to an independent anode chamber, an electroplating tank device, and an electroplating solution supply method. Prior Technology

[0002] Existing wafer plating tanks are generally one-piece structures, including an anode chamber and a cathode chamber. An ion-exchange membrane is installed between the anode and cathode chambers to prevent direct mixing of the plating solutions. The anode assembly typically includes a circulation pipe connected to the anode chamber and an anode plate inserted inside the anode chamber and connected to the positive terminal of the power supply to ensure a stable supply of metal ions. The anode assembly of the plating tank is susceptible to oxidation and requires regular maintenance. Each chamber of the plating tank must have sufficient space for disassembly and cleaning. Existing one-piece plating tank structures are bulky, consume a large amount of plating solution, and are time-consuming and inconvenient to disassemble and maintain. Summary of the Invention

[0003] In order to overcome the shortcomings of the prior art, the purpose of this invention is to provide an independent anode chamber, an electroplating tank device, and an electroplating solution supply method.

[0004] To achieve the above objectives, the technical solution adopted by the present invention to solve its technical problem is: an independent anode chamber, comprising:

[0005] The anode chamber body has a flat structure with an opening at the top. The anode chamber body has a flat inner cavity for placing the anode plate assembly and holding the anode electroplating solution. A lateral opening is provided on one side of the anode chamber body, and an ion membrane is installed at the lateral opening.

[0006] An anode plate assembly includes an anode plate, a base plate, and a conductive sheet. The anode plate and the conductive sheet are both fixedly mounted on the base plate. The anode plate and the conductive sheet are in contact and conducting with each other. The base plate is vertically mounted in the flat inner cavity of the anode chamber body, with the anode plate facing the ion membrane side.

[0007] The flat inner cavity volume of the anode chamber body of this invention is significantly reduced compared to the anode cavity volume of the integrated electroplating tank in the prior art, which can save the amount of anode plating solution used. The anode chamber adopts an independent structure and can be detached from the electroplating tank, which facilitates the maintenance and operation of the anode chamber and enables maintenance without stopping the machine when using spare anode chambers.

[0008] Furthermore, the base plate of the anode plate assembly is installed in the flat inner cavity of the anode chamber body using a vertical insertion method.

[0009] The above-mentioned preferred solution facilitates the rapid installation of the anode plate assembly on the anode chamber body.

[0010] Furthermore, the bottom of the anode chamber body is provided with a lower circulation port communicating with the flat inner cavity, and the upper part of the anode chamber body is provided with an upper circulation port communicating with the flat inner cavity.

[0011] By adopting the above-mentioned preferred scheme, the circulation of the anodic electroplating solution within the anodic chamber is promoted, thereby improving the fluidity and uniformity of the cations.

[0012] Furthermore, the lower circulation port extends downward from the bottom surface of the anode chamber body, a sealing ring is fitted around the outer periphery of the lower circulation port, and the bottom of the electroplating tank is provided with an insertion hole that matches the lower circulation port.

[0013] The preferred solution described above facilitates the connection of the lower circulation port of the anode chamber below the electroplating tank, preventing the cathodic plating solution in the electroplating tank from overflowing from the lower circulation port.

[0014] Furthermore, an annular sealing gasket and a titanium ring are sequentially installed above the ion membrane at the lateral opening of the anode chamber body.

[0015] By adopting the above-mentioned preferred solution, the sealing effect at the ion exchange membrane is improved.

[0016] Furthermore, the anode chamber body has a concave mounting surface at its lateral opening, and a plurality of convex positioning posts are provided on the mounting surface. The ion membrane, the annular sealing gasket, and the titanium ring are provided with positioning holes that match the outer circumference of the positioning posts. The locking screw passes through the positioning holes on the titanium ring, the annular sealing gasket, and the ion membrane in sequence and connects with the central hole of the positioning post.

[0017] By adopting the above-mentioned preferred solution, the stability of the ion exchange membrane installation position is improved.

[0018] Furthermore, an annular shielding plate is provided above the titanium ring.

[0019] Furthermore, the conductive sheet of the anode plate assembly includes an annular connecting portion connected to the edge of the anode plate and an upper extension portion extending upward from the annular connecting portion.

[0020] By adopting the above-mentioned preferred scheme, the electrical conductivity between the anode plate and the power supply anode is improved.

[0021] Furthermore, the thickness of the anode chamber body is less than 80 mm.

[0022] An electroplating tank apparatus, comprising: Electroplating tank, used to hold cathode electroplating solution; A mounting bracket for holding a substrate to be electroplated, the bracket being vertically inserted into the electroplating tank; and The aforementioned independent anode chamber is vertically inserted into the electroplating tank, and the independent anode chamber is arranged parallel to the hanger.

[0023] The above technical solution has a compact structure, reduces the amount of anolyte used, saves electroplating costs, and reduces the space occupied by the electroplating tank.

[0024] A method for supplying electroplating solution involves placing cathodic electroplating solution in an electroplating tank, placing anodic electroplating solution in the flat inner cavity of an independent anode chamber, and connecting a circulation pump via a pipeline between the lower circulation port and the lower circulation port of the independent anode chamber to promote the circulation of the anodic electroplating solution within the independent anode chamber. Simple Explanation of the Diagram

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without making progressive changes. Figure 1 is a schematic diagram of the independent anode chamber of the present invention; Figure 2 is a cross-sectional view of the independent anode chamber of the present invention; Figure 3 is a schematic diagram of the ion membrane installation structure on the anode chamber body; Figure 4 is a schematic diagram of the ion membrane mounting surface with a side opening on the anode chamber body; Figure 5 is a schematic diagram of the anode plate assembly; Figure 6 is a schematic diagram of the rear structure of the anode plate assembly; Figure 7 is a structural schematic diagram of the electroplating tank device of the present invention; and Figure 8 is a cross-sectional view of the electroplating tank device of the present invention. Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making progressive changes are within the scope of protection of the present invention.

[0027] As shown in Figures 1-6, one embodiment of the present invention includes: an independent anode chamber 10 comprising:

[0028] The anode chamber body 11 has a flat structure with an opening at the top. The anode chamber body 11 has a flat inner cavity 111 for placing the anode plate assembly 13 and holding the anode electroplating solution. A lateral opening is provided on one side of the anode chamber body 11, and an ion membrane 12 is installed at the lateral opening.

[0029] The anode plate assembly 13 includes an anode plate 131, a base plate 132, and a conductive sheet 133. The anode plate 131 and the conductive sheet 133 are both fixedly installed on the base plate 132. The anode plate 131 and the conductive sheet 133 are in contact and conducting with each other. The base plate 132 is vertically installed in the flat inner cavity 111 of the anode chamber body 11, with the anode plate 131 facing the ion membrane 12.

[0030] The advantages of adopting the above technical solution are: the volume of the flat inner cavity of the anode chamber is significantly reduced compared to the anode cavity volume of the previous integrated electroplating tank, which can save the amount of anode plating solution used. The anode chamber adopts an independent structure and can be disassembled and installed with the electroplating tank, which facilitates the maintenance and operation of the anode chamber, and can achieve maintenance without stopping the machine when using spare anode chambers.

[0031] In other embodiments of the present invention, the base plate 132 of the anode plate assembly is installed in the flat inner cavity 111 of the anode chamber body using a vertical insertion method. Here, the specific insertion and mating structure used between the base plate and the anode chamber body is not limited and can be selected from prior art. For example, guide ribs are provided on both sides of the base plate, and vertically arranged slots are opened in the flat inner cavity of the anode chamber body, with the guide ribs of the base plate inserted into the slots. The beneficial effect of adopting the above technical solution is that it facilitates the rapid installation of the anode plate assembly on the anode chamber body.

[0032] In other embodiments of the present invention, the bottom of the anode chamber body 11 is provided with a lower circulation port 112 communicating with the flat inner cavity 111, and the upper part of the anode chamber body 11 is provided with an upper circulation port 113 communicating with the flat inner cavity 111. The lower circulation port 112 extends downward from the bottom surface of the anode chamber body 11, and a sealing ring 1121 is fitted around the outer periphery of the lower circulation port 112. The bottom of the electroplating tank 20 is provided with an insertion hole that matches the outer periphery of the lower circulation port 112. The beneficial effect of adopting the above technical solution is that it facilitates the connection of the lower circulation port of the anode chamber below the electroplating tank and prevents the cathode electroplating solution in the electroplating tank from overflowing from the lower circulation port.

[0033] In other embodiments of the present invention, an annular sealing gasket 121 and a titanium ring 122 are sequentially installed above the ion membrane 12 at the lateral opening of the anode chamber body 11. An annular shielding plate 123 is also provided above the titanium ring 122. The beneficial effect of adopting the above technical solution is to improve the sealing effect at the ion membrane.

[0034] In other embodiments of the present invention, the anode chamber body 11 has a concave mounting surface 114 at its lateral opening. The mounting surface 114 has a plurality of convex positioning posts 1141. The ion exchange membrane 12, the annular sealing gasket 121, and the titanium ring 122 have positioning holes that match the outer circumference of the positioning posts 1141. Locking screws pass sequentially through the positioning holes on the titanium ring 122, the annular sealing gasket 121, and the ion exchange membrane 12, and are connected to the central hole of the positioning posts 1141. The beneficial effect of adopting the above technical solution is to improve the stability of the ion exchange membrane installation position.

[0035] In other embodiments of the present invention, the conductive sheet 133 of the anode plate assembly 13 includes an annular connecting portion 1331 connected to the edge of the anode plate and an upper extension portion 1332 extending upward from the annular connecting portion. The beneficial effect of adopting the above technical solution is to improve the electrical conductivity between the anode plate and the power anode.

[0036] In other embodiments of the present invention, the thickness of the anode chamber body 11 is less than 80 mm.

[0037] As shown in Figures 7 and 8, an electroplating tank device includes: Electroplating tank 20 is used to hold cathode electroplating solution; Hanger 30, used to hold the substrate to be electroplated, is vertically inserted into the electroplating tank 20; and An independent anode chamber 10 is vertically inserted into the electroplating tank 20, and the independent anode chamber 10 is set parallel to the hanger 30.

[0038] The advantages of adopting the above technical solution are: compact structure, reduced use of anodic electroplating solution, saving electroplating costs, and reduced space occupied by the electroplating tank.

[0039] A method for supplying electroplating solution involves placing cathodic electroplating solution in an electroplating tank, placing anodic electroplating solution in the flat inner cavity of an independent anode chamber, and connecting a circulation pump via a pipeline between the lower circulation port and the lower circulation port of the independent anode chamber to promote the circulation of the anodic electroplating solution within the independent anode chamber.

[0040] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

[0041] 10: Independent anode compartment 11: Anode Chamber Body 111: Flattened inner cavity 112: Lower circulation port 1121: Sealing ring 113: Upper circulation port 114: Mounting surface 1141: Positioning Post 12: Ion exchange membrane 121: Annular sealing gasket 122: Titanium Ring 123: Circular shielding plate 13: Anode plate assembly 131: Anode plate 132: Base Plate 133: Conductive sheet 1331: Annular connecting part 1332:Shangyan Department 20: Electroplating bath 30: Hanging fixture

Claims

1. A freestanding anode chamber, comprising: An anode chamber body has a flat structure with an opening at the top. The anode chamber body contains a flat inner cavity for placing an anode plate assembly and holding an anode plating solution. A lateral opening is provided on one side of the anode chamber body, and an ion exchange membrane is installed at the lateral opening. An anode plate assembly includes an anode plate, a base plate, and a conductive sheet. The anode plate and the conductive sheet are both fixedly mounted on the base plate and are electrically connected. The anode plate assembly is vertically mounted in the flat inner cavity of the anode chamber body, with the anode plate facing the ion exchange membrane.

2. The freestanding anode compartment according to claim 1, wherein, The base plate of the anode plate assembly is installed in the flat inner cavity of the anode chamber body using a vertical insertion method.

3. The freestanding anode compartment according to claim 1, wherein, The bottom of the anode chamber body is provided with a lower circulation port that communicates with the flat inner cavity, and the upper part of the anode chamber body is provided with an upper circulation port that communicates with the flat inner cavity.

4. The freestanding anode compartment according to claim 3, wherein, The lower circulation port extends downward from the bottom of the anode chamber body, and a sealing ring is fitted around the outer periphery of the lower circulation port. The bottom of the electroplating tank is provided with an insertion hole that matches the lower circulation port.

5. The freestanding anode compartment according to claim 1, wherein, An annular sealing gasket and a titanium ring are sequentially installed above the ion membrane at the lateral opening of the anode chamber body.

6. The freestanding anode compartment according to claim 5, wherein, The anode chamber body has a recessed mounting surface at its side opening. The mounting surface has a plurality of protruding positioning posts. The ion membrane, the annular sealing gasket, and the titanium ring have positioning holes that match the outer circumference of the positioning posts. The locking screw passes through the positioning holes on the titanium ring, the annular sealing gasket, and the ion membrane in sequence and connects with the center hole of the positioning post.

7. The freestanding anode compartment according to claim 5, wherein, A ring-shaped shielding plate is also provided above the titanium ring.

8. The freestanding anode compartment according to claim 1, wherein, The conductive sheet of the anode plate assembly includes an annular connecting portion connected to the edge of the anode plate and an upper extension portion extending upward from the annular connecting portion.

9. An electroplating tank apparatus, comprising: An electroplating tank, used to hold cathode electroplating solution; A hanger for loading a substrate to be electroplated, the hanger being vertically inserted into the electroplating tank; And a freestanding anode compartment as described in any of claims 1-9, wherein the freestanding anode compartment is vertically inserted into the electroplating tank and is arranged parallel to the hanger.

10. A method for supplying electroplating solution, employing an electroplating tank apparatus as described in claim 9, wherein a cathode electroplating solution is placed in the electroplating tank, an anode electroplating solution is placed in the flat inner cavity of an independent anode compartment, and a circulation pump is connected via a pipeline between the lower circulation port and the lower circulation port of the independent anode compartment to promote the flow of the anode electroplating solution within the independent anode compartment.

Images