Substrate processing device

Abstract

This disclosure presents a substrate processing apparatus, including a first process chamber, a second process chamber, a transfer chamber, a robot arm, an air inlet unit, and an exhaust end. The first process chamber is disposed in the lower region of the substrate processing apparatus, and the second process chamber is disposed in the upper region of the substrate processing apparatus. The robot arm is disposed in the transfer chamber and is used to feed or remove substrates from the transfer chamber into or from the first and second process chambers, respectively. The air inlet unit is disposed in the lower part of the transfer chamber and is used to generate an upward airflow in the transfer chamber. This disclosure can avoid the problem of gas diffusing from the second process chamber affecting the surface of the substrate in the transfer chamber.

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