An integrated 3D vapor chamber and a liquid cooling heat dissipation module including the same

Abstract

An integrated 3D vapor chamber includes a metallic top cover and a metallic bottom cover. The outer heat-dissipating surface of the metallic top cover has a plurality of hollow heat dissipation columns. The inner evaporation surface of the metallic bottom cover has protrusive the first supporting structures disposed thereon. The integrated 3D vapor chamber is formed by engaging the metallic top cover and the metallic bottom cover. The entire structure of the metallic top cover including the hollow heat-dissipating columns is made as a unique piece from the same metal body, and the entire structure of the metallic bottom cover including the plurality of the first supporting structures is made as a unique piece from the same metal body. A liquid cooling heat-dissipation module is also proposed, which includes a liquid cooling cover and the integrated 3D vapor chamber. The liquid cooling cover engages with the outer heat-dissipating surface of the metallic top cover with the hollow heat-dissipating columns accommodating within the liquid cooling space, which allows a cooling liquid entering to the liquid cooling space from the liquid inlet and flow through the hollow heat-dissipating columns, and flow out from the liquid outlet.