Deformation sensor module of wafer bonding equipment and assembly method thereof

Abstract

This invention provides a deformation sensor module for a wafer bonding apparatus capable of measuring wafer deformation in a wafer bonding apparatus and its assembly method, comprising: a sensor unit for measuring the deformation of the wafer; a chuck body for internally accommodating at least a portion of the sensor unit, wherein the front end of the sensor unit sensing the wafer can protrude and be fixed to one end of the chuck body at a preset protrusion height, wherein at least a portion of the one end is formed as a tightening portion divided by a plurality of slots, and the position of the internally housed sensor unit can be fixed by tightening the tightening portion; and a cover portion for engaging with one end of the chuck body on which the tightening portion is formed, and applying pressure to the tightening portion in the direction toward the sensor unit to tighten the tightening portion toward the sensor unit.

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