Glass couplers for photonic integrated circuits

TW202630054APending Publication Date: 2026-07-16LIGHTMATTER INC
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Patent Information

Application Number
TW114146219
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-26
Filing Date
2025-11-26
Publication Date
2026-07-16
Patent Text Reader

Abstract

Described herein are fiber-connection structures for photonic integrated circuits (PICs). These fiber connection structures enable efficient optical coupling between integrated waveguides and corresponding optical fibers by facilitating reliable edge coupling. The fiber-connection designs developed by the inventor improve upon conventional approaches by increasing fan-out fiber capability, coupling efficiency and scalability. A photonic package comprises a substrate, a PIC, an application-specific integrated circuit (ASIC) and a glass coupler. The PIC is attached to the substrate and comprises a PIC waveguide having an end adjacent an edge of the PIC. The ASIC is attached to the PIC. The glass coupler is attached to the PIC and comprises a glass waveguide optically coupled to the PIC waveguide.
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