Protective film frame, protective film, and method for peeling off the protective film.
TW202630137APending Publication Date: 2026-07-16SHIN ETSU CHEMICAL CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- SHIN ETSU CHEMICAL CO LTD
- Filing Date
- 2026-01-02
- Publication Date
- 2026-07-16
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Figure TWG2TA001069281_001 
Figure TWG2TA001069281_002 
Figure TWG2TA001069281_003
Abstract
This invention provides a protective film frame, a protective film comprising the protective film frame as a component, and a method for peeling the protective film off a self-exposure substrate. The protective film frame 1 is a metal, quadrilateral frame containing four sides 11, 11, 11, 11 and four corners 12, 12, 12, 12, for EUV lithography. The protective film frame 1 is characterized in that the top-view width W2 of the corners 12 is wider than the top-view width W1 of the sides 11. According to this invention, the deflection of the protective film frame during the peeling off of the self-exposure substrate can be suppressed, thereby reducing the risk of damage to the protective film.
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