Pattern determination method

Abstract

This invention provides an exposure apparatus that can not only handle wafer positional shifts but also manufacture components in high throughput. The exposure apparatus exposes a photosensitive layer formed above lead-out electrodes disposed on a plurality of semiconductor wafers arranged on a substrate. The exposure apparatus includes: a substrate platform on which the plurality of semiconductor wafers are arranged along a single axis; an exposure unit that irradiates exposure light toward the lead-out electrodes disposed on the semiconductor wafers in electrode formation regions extending along the single axis; a pattern determination unit that determines the exposure pattern to be exposed on the photosensitive layer by the exposure unit; and a control unit that controls at least the substrate platform and the exposure unit. The pattern determination unit uses output from a measurement unit to determine the pattern of the transition wiring connecting the lead-out electrodes to predetermined positions relative to the substrate as the exposure pattern. The measurement unit measures the positions of the plurality of semiconductor wafers disposed on the substrate to determine the positional shift of the plurality of semiconductor wafers. The control unit moves the substrate from one side to the other in the uniaxial direction via the substrate platform, while the exposure unit exposes the pattern of the transition wiring on the photosensitive layer within an exposure area extending in the uniaxial direction.