Method to align a substrate for lithography and system performing the same, and machine-readable medium embodying instructions
TW202630144APending Publication Date: 2026-07-16ONTO INNOVATION INC
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Patent Information
- Application Number
- TW115113333
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2026-07-16
Abstract
A photolithography machine with an alignment system is described. The photolithography machine can identify a fiducial pattern provided on a substrate and use the location of the fiducial pattern to align the substrate before exposure. The fiducial pattern can include a plurality of fiducial markings arranged in a specified pattern. A model matching technique can be applied to match the respective individual fiducial markings. A shaping technique can then be used to identify the fiducial pattern based on the matched fiducial markings.
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