System-on-a-chip and method of manufacturing the same

Abstract

A system-on-a-chip (SoC) includes segmented interposers and computer chips, such as high-bandwidth memory (HBM) devices. One computer chip is on each segmented interposer. The SoC also includes second interposers connecting the segmented interposers together. At least some of the second interposers extend across a gap between adjacent segmented interposers. The SoC also includes an organic substrate coupled to each of the segmented interposers.