Plasma equipment for semiconductor manufacturering facility

TW202630447APending Publication Date: 2026-07-16LOT CES CO LTD
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Patent Information

Application Number
TW114121254
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-14
Filing Date
2025-06-06
Publication Date
2026-07-16
Patent Text Reader

Abstract

According to the present invention, there is provided plasma equipment for treating an exhaust gas of a semiconductor manufacturing facility, as equipment which treats the exhaust gas discharged from a semiconductor process chamber in which a semiconductor manufacturing process using process gases is to be performed, through a chamber exhaust pipe for connecting the semiconductor process chamber to a vacuum pump, by using the vacuum pump, the plasma equipment including an exhaust pipe plasma reactor, which is installed on the chamber exhaust pipe, generates plasma in the exhaust gas and removes ingredients to be removed, contained in the exhaust gas; a remote plasma reactor, which generates plasma, decomposes a source gas for remote plasma and generates a remote plasma gas including reactive species; a power supply unit, which produces alternating current power required for an operation of the exhaust pipe plasma reactor and the remote plasma reactor; and a power distributor, which distributes the alternating current power produced by the power supply unit and supplies the distributed alternating current power to the exhaust pipe plasma reactor and the remote plasma reactor, respectively.
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