Upper electrode assembly, substrate processing apparatus, manufacturing method of upper electrode assembly, and maintenance method of upper electrode assembly

TW202630459APending Publication Date: 2026-07-16TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
TOKYO ELECTRON LTD
Filing Date
2025-11-13
Publication Date
2026-07-16

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Abstract

The upper electrode assembly disclosed in this invention includes an upper electrode plate, a heat transfer plate, and a connecting portion. The connecting portion joins the upper electrode plate and the heat transfer plate. The connecting portion comprises a low-melting-point metal having a melting point in the range of 50°C to 300°C.
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