Integrated temperature control system for subassemblies
TW202630522APending Publication Date: 2026-07-16AMERICAN CO ADIA SEMICON BONDING TECH CO LTD
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Patent Information
- Application Number
- TW114142425
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-27
- Filing Date
- 2025-10-31
- Publication Date
- 2026-07-16
Abstract
Embodiments herein provide for an integrated thermal control assembly comprising: a semiconductor device; a cold plate stacked vertically adjacent to the semiconductor device; and a heater device disposed adjacent to the semiconductor device and the cold plate.
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