Semiconductor device and method of forming thereof
TW202630764APending Publication Date: 2026-07-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114128605
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-05-30
- Filing Date
- 2025-07-28
- Publication Date
- 2026-07-16
Abstract
A semiconductor device and the method of forming the same are provided. The semiconductor device may include a source / drain region, a first nanostructure along a sidewall of the source / drain region, a gate structure wrapping around the first nanostructure, a first gate spacer along a sidewall of a first portion of the gate structure, a first dielectric layer over the source / drain region and the gate structure, a first conductive contact extending through the first dielectric layer and electrically connected to the source / drain region, and a first dielectric liner along a sidewall of the first conductive contact. The first dielectric liner may extend from a level of a top surface of the first conductive contact to a top surface of the source / drain region. The first dielectric liner may be in contact with a sidewall of the first gate spacer.
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