Semiconductor device and method of forming thereof

TW202630764APending Publication Date: 2026-07-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114128605
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-05-30
Filing Date
2025-07-28
Publication Date
2026-07-16
Patent Text Reader

Abstract

A semiconductor device and the method of forming the same are provided. The semiconductor device may include a source / drain region, a first nanostructure along a sidewall of the source / drain region, a gate structure wrapping around the first nanostructure, a first gate spacer along a sidewall of a first portion of the gate structure, a first dielectric layer over the source / drain region and the gate structure, a first conductive contact extending through the first dielectric layer and electrically connected to the source / drain region, and a first dielectric liner along a sidewall of the first conductive contact. The first dielectric liner may extend from a level of a top surface of the first conductive contact to a top surface of the source / drain region. The first dielectric liner may be in contact with a sidewall of the first gate spacer.
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