Semiconductor device and method for fabricating the same

TW202630779APending Publication Date: 2026-07-16SK HYNIX INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SK HYNIX INC
Filing Date
2025-10-14
Publication Date
2026-07-16

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Abstract

A semiconductor device includes a first conductive line including an upper portion of a carbon-based thin layer; a variable resistance layer disposed over the first conductive line; a selector layer disposed over the variable resistance layer, with a carbon-based thin layer disposed thereon; and a second conductive line disposed over the selector layer.
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