Semiconductor device and forming method thereof

TW202630785APending Publication Date: 2026-07-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114116673
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-10
Filing Date
2025-05-02
Publication Date
2026-07-16
Patent Text Reader

Abstract

Semiconductor devices and methods of forming the same are provided. An exemplary method includes forming a superlattice structure over a substrate, the superlattice structure comprising an upper portion separated from a lower portion by an insulation layer, wherein the insulation layer comprises a crystalline metal oxide, patterning the superlattice structure to form a fin protruding from the substrate, forming a dummy gate stack over a first portion of the fin, recessing a second portion of the fin not covered by the dummy gate stack to form a source / drain trench, forming a first source / drain feature in the source / drain trench and coupled to the lower portion of the superlattice structure, forming a second source / drain feature in the source / drain trench and coupled to the upper portion of the superlattice, and replacing the dummy gate stack by a gate structure.
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