Semiconductor device and forming method thereof
TW202630785APending Publication Date: 2026-07-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114116673
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-10
- Filing Date
- 2025-05-02
- Publication Date
- 2026-07-16
Abstract
Semiconductor devices and methods of forming the same are provided. An exemplary method includes forming a superlattice structure over a substrate, the superlattice structure comprising an upper portion separated from a lower portion by an insulation layer, wherein the insulation layer comprises a crystalline metal oxide, patterning the superlattice structure to form a fin protruding from the substrate, forming a dummy gate stack over a first portion of the fin, recessing a second portion of the fin not covered by the dummy gate stack to form a source / drain trench, forming a first source / drain feature in the source / drain trench and coupled to the lower portion of the superlattice structure, forming a second source / drain feature in the source / drain trench and coupled to the upper portion of the superlattice, and replacing the dummy gate stack by a gate structure.
Need to check novelty before this filing date? Find Prior Art