Semiconductor device and method of fabricating the same

TW202630803APending Publication Date: 2026-07-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114123066
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-29
Filing Date
2025-06-19
Publication Date
2026-07-16
Patent Text Reader

Abstract

A semiconductor device includes a first source / drain structure; a second source / drain structure spaced from the first source / drain structure in a first direction; a first portion of a first channel structure adjacent the first source / drain structure at a first height; a second portion of the first channel structure adjacent the second source / drain structure, the second portion of the first channel structure being at the first height and spaced from the first portion of the first channel structure in the first direction; an insulating structure between the first and second portions of the first channel structure, the insulating structure being at the first height and having a thickness that is at least as thick as either of the first and second portions of the first channel structure; and a second channel structure between the first and second source / drain structures at a second height, the second height being less than the first height.
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