Semiconductor device and method of fabricating the same
TW202630803APending Publication Date: 2026-07-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114123066
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-29
- Filing Date
- 2025-06-19
- Publication Date
- 2026-07-16
Abstract
A semiconductor device includes a first source / drain structure; a second source / drain structure spaced from the first source / drain structure in a first direction; a first portion of a first channel structure adjacent the first source / drain structure at a first height; a second portion of the first channel structure adjacent the second source / drain structure, the second portion of the first channel structure being at the first height and spaced from the first portion of the first channel structure in the first direction; an insulating structure between the first and second portions of the first channel structure, the insulating structure being at the first height and having a thickness that is at least as thick as either of the first and second portions of the first channel structure; and a second channel structure between the first and second source / drain structures at a second height, the second height being less than the first height.
Need to check novelty before this filing date? Find Prior Art