Adjustment equipment and methods for wafer processing devices

Abstract

Embodiments of this application provide an adjustment device and method for a wafer processing apparatus. The wafer processing apparatus includes a cavity and a spray head and a tray disposed within the cavity. The spray head is movably disposed on the top wall of the cavity and has spray head feature points. The tray has tray feature points. The adjustment device includes a measuring device, an adjustment device, and a controller. The measuring device is used to acquire the positions of the tray feature points and the spray head feature points. The adjustment device is used to adjust the position of the spray head in the horizontal direction. The controller is configured to adjust the position of the spray head in the horizontal direction based on the positions of the tray feature points and the spray head feature points, so that the axis of the spray head coincides with the axis of the tray in the horizontal direction. The adjustment device for a wafer processing apparatus of this application can uniformly process wafers.

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