Chip lamination device

Abstract

A chip lamination device is provided. The chip lamination device includes a lower board device, a heating device, a lifting mechanism, a spring assembly, a linear driving mechanism, an upper board device, a pressing mechanism, and a lead weight assembly. The heating device is connected to the lower board device. The spring assembly is connected between the lifting mechanism and the lower board device. The pressing mechanism includes multiple pressing rods. The linear driving mechanism drives the pressing mechanism, so that the pressing rods touch the lifting mechanism, thereby moving the lifting mechanism and the spring assembly relative to the lower board device. The lead weight assembly includes multiple chain components, one end of each chain component is located at different positions on the surface of the upper board device. The contact surface of the upper board device presses against the sapphire substrate on the lifting mechanism, to drive the sapphire substrate to press the chip. These chain components gradually release from a tensioned position to a relaxed position.

Description

Technical Field

[0001] The present disclosure relates to a chip bonding device, and more particularly to a chip bonding device for bonding a chip to a sapphire substrate. Prior Art

[0002] The wafer thinning process is a step in the semiconductor manufacturing process that is primarily used to reduce the thickness of completed wafers. This process is typically performed before the packaging and testing stages, with the goal of achieving smaller, lighter, and more efficient electronic products. The specific steps of the wafer thinning process typically include dicing, thinning, and optional structural reinforcement. The dicing step involves cutting the wafer into small pieces, usually single semiconductor dies, which will be used in subsequent packaging. The thinning step involves gradually thinning the back side (non-circuit side) of the wafer using mechanical or chemical methods. The structural reinforcement step sometimes requires adding a protective layer to the wafer surface, or using other methods during the process to enhance the structural stability of the wafer surface.

[0003] Before the wafer thinning process begins, the wafer and sapphire substrate need to be bonded together using liquid wax as a medium. However, this often results in poor bonding between the wafer and sapphire substrate, affecting yield. Summary of the Invention

[0004] The disclosed embodiment provides a chip bonding device, which improves and achieves the effect of smoothly bonding a sapphire substrate and a chip.

[0005] One embodiment of the present disclosure provides a wafer bonding apparatus for bonding a wafer to a sapphire substrate. The wafer bonding apparatus includes a lower plate assembly, a heating device, a lifting mechanism, multiple reset components, a linear drive mechanism, an upper plate assembly, a lower pressing mechanism, and a plumb bob assembly. The lower plate assembly is configured to support a wafer. The heating device is connected to the lower plate assembly. The lifting mechanism is configured to support a sapphire substrate. Multiple reset components are connected between the lifting mechanism and the lower plate assembly. The upper plate assembly includes a contact surface and a mounting surface. The down-pressing mechanism is connected to the linear drive mechanism, and the down-pressing mechanism is located outside the upper plate device. The down-pressing mechanism includes a plurality of down-pressing rods. The linear drive mechanism drives the down-pressing mechanism. The down-pressing rods touch the lifting mechanism to drive the lifting mechanism and the reset components connected thereto to move relative to the lower plate device. The plumb bob component is connected between the linear drive mechanism and the setting surface of the upper plate device. The plumb bob component includes a plurality of chain elements. One end of these chain elements is respectively located at different positions on the setting surface of the upper plate device. These chain elements respectively have a tensioning position. The contact surface of the upper plate device contacts the sapphire substrate to drive the sapphire substrate to press the wafer, and these chain elements are gradually released from the tensioning position and have a relaxed position.

[0006] In one embodiment, the lifting mechanism can move between an initial position and a pressing position relative to the lower plate device. When the lifting mechanism is in the initial position, the wafer has a wafer supporting position. The linear drive mechanism drives the pressing mechanism to move in a pressing direction. The pressing mechanism drives the plumb bob assembly to move the upper plate device connected to it. When the upper plate device is moved to a fitting position, the contact surface of the upper plate device contacts the sapphire substrate. The lifting mechanism moves from the initial position to the pressing position. These reset components have a reset kinetic energy.

[0007] In one embodiment, the linear drive mechanism drives the pressing mechanism to move in an upward direction, and the pressing mechanism drives the plumb bob assembly and the upper plate device connected thereto to follow the movement. The upward direction is opposite to the pressing direction, so that the pressing rods move away from the lifting mechanism. The resetting kinetic energy of the resetting assemblies causes the lifting mechanism to move from the pressing position to the initial position, and the bonded wafer and sapphire substrate are also lifted, so that the wafer is separated from the wafer supporting position and is located at a finished product position.

[0008] In one embodiment, the number of the chain elements is three, and the three chain elements constitute a plumb bob counterweight structure.

[0009] In one embodiment, the plumb bob assembly is a ball chain structure or a plumb bob chain structure.

[0010] In one embodiment, the plumb bob assembly is a ball chain structure, the plumb bob assembly includes a ball chain, each ball chain includes a plurality of ball links and a chain, and each ball link is connected to an adjacent ball link through the chain.

[0011] In one embodiment, the above-mentioned plumb bob assembly is a plumb bob chain structure, and the plumb bob assembly includes a plumb bob chain, and the bottom end of each plumb bob chain is connected to the top end of another plumb bob chain.

[0012] In one embodiment, the wafer bonding apparatus further includes a vacuum chamber and an exhaust device. The lower plate assembly, the lifting mechanism, the reset components, the upper plate assembly, the downward pressure mechanism, the plumb bob assembly, and the heating device are each located within the vacuum chamber. The exhaust device is connected to the vacuum chamber and is used to evacuate air from the vacuum chamber.

[0013] In one embodiment, the wafer bonding device further includes a horizontal adjustment mechanism connected to the plumb bob assembly, wherein the linear drive mechanism includes a connecting plate, and the horizontal adjustment mechanism includes a screw, a connecting portion, and a screw adjustment portion, wherein one end of the screw is rotatably disposed on the connecting plate, and the other end of the screw is connected to the connecting portion, and a distance is separated between the connecting portion and the connecting plate.

[0014] In one embodiment, the pressing mechanism is spaced apart from the upper plate device by a distance.

[0015] In one embodiment, the position of the pressing rod is such that it protrudes from the contact surface of the upper plate device.

[0016] In one embodiment, the above-mentioned lower plate device includes a bottom plate portion and a bearing portion, the bearing portion is arranged on the bottom plate, the bearing portion has a bearing surface, and three grooves are arranged on one outer surface of the bearing portion. The lifting mechanism includes a floating device, a hollow portion, and three supporting elements. The hollow portion is a hole of the floating device, and the hollow portion is connected to the interior of the bearing portion of the lower plate device. The three supporting elements are a protruding structure on the inner side of the floating device, and the position of each supporting element corresponds to the position of the groove, and each supporting element can move within the corresponding groove.

[0017] In one embodiment, each of the above-mentioned reset assemblies includes an elastic element, which is respectively connected between the floating device and the bottom plate, and the positions of the pressing rods correspond to the positions of the elastic elements.

[0018] In one embodiment, each of the reset components includes a vertical column, which is inserted into the buoyancy device, and the bottom ends of the vertical columns are fixed to the bottom plate.

[0019] In one embodiment, a recess is provided at the front end of one of the above-mentioned supporting elements.

[0020] In one embodiment, the supporting element has a smooth structure.

[0021] In one embodiment, the surface of the above-mentioned lifting device is provided with three concave surfaces and three convex surfaces, the surfaces of these concave surfaces are lower than the surfaces of these convex surfaces, and the surface of each supporting element is flush with the surface of the corresponding convex surface, and the positions of these downward pressure rods correspond to the positions of these concave surfaces in the lifting device.

[0022] In one embodiment, the contact surface of the upper plate device is a smooth structure.

[0023] In one embodiment, the linear drive mechanism includes a connecting rod, a driving module, and a connecting plate. The connecting rod is connected between the driving module and the connecting plate, and the pressing mechanism is connected to the connecting plate.

[0024] In one embodiment, the driving module includes a driving motor and a slide mechanism, the driving motor is connected to the slide mechanism, one end of the connecting rod is connected to the slide mechanism, and the other end of the connecting rod is connected to the connecting plate.

[0025] In one embodiment, the lower plate device has a smooth structure.

[0026] In one embodiment, the upper plate device is provided with a heat source.

[0027] Based on the above, the present disclosure discloses that during the process of the upper plate device descending to the bonding position, the three chain elements gradually release from the tightened position to a relaxed position. This is because at this time, the chain elements do not generate a certain amount of force when pulling the upper plate device upward, and gradually release, which can reduce friction with the upper plate device and minimize resistance to almost zero friction, thereby achieving the purpose of smoothly driving the upper plate device and improving the flatness of the sapphire substrate when bonding to the wafer.

[0028] Furthermore, the structural characteristics of the chain of the chain element disclosed herein form a plumb bob counterweight structure, which allows the upper plate device to move smoothly without deviating from the horizontal position, ensuring that the contact surface of the upper plate device is not deviated, thereby allowing the contact surface of the upper plate device to be flatly attached to the sapphire substrate.

[0029] To make the present disclosure more clear and easy to understand, embodiments are given below and described in detail with reference to the accompanying drawings. Simple diagram description

[0030] FIG1 is a schematic diagram of a wafer bonding apparatus according to an embodiment of the present disclosure. FIG. 2 is a schematic diagram illustrating a pressing action of a wafer bonding apparatus according to an embodiment of the present disclosure. FIG3 is a schematic diagram of an embodiment of a wafer bonding apparatus according to the present disclosure after lamination is completed. FIG4 is a perspective view of an embodiment of a lower plate device combined with a lifting mechanism and a reset assembly according to the present disclosure. FIG5 is a perspective view of another angle of an embodiment of a lower plate device combined with a lifting mechanism and a reset assembly according to the present disclosure. FIG6 is a perspective view of an embodiment of a lower plate device combined with a lifting mechanism and a reset assembly according to the present disclosure. FIG. 7 is a schematic diagram of a plumb bob assembly and a linear drive mechanism according to an embodiment of the present disclosure. FIG8 is a perspective view of a plumb bob assembly according to an embodiment of the present disclosure. FIG. 9 is a perspective view of another embodiment of a plumb bob assembly according to the present disclosure. FIG. 10 is a perspective view of another embodiment of a plumb bob assembly according to the present disclosure. FIG. 11 is a perspective view showing the corresponding positions of the pressing rod and the buoyancy device according to the present disclosure. FIG. 12 is a perspective diagram showing the corresponding positions of the pressing mechanism, the lifting mechanism, and the lower plate device according to the present disclosure from another perspective. FIG13 is a partially enlarged perspective view of the level adjustment mechanism and the plumb bob assembly according to the present disclosure. FIG14 is a partially enlarged side view of the horizontal adjustment mechanism and plumb bob assembly according to the present disclosure. FIG. 15 is a perspective view of another embodiment of a wafer bonding apparatus according to the present disclosure. FIG. 16 is a perspective view of another embodiment of a wafer bonding apparatus according to the present disclosure. Implementation Method

[0031] The following examples are listed and illustrated in detail. However, these examples are not intended to limit the scope of this disclosure. Furthermore, the drawings are for illustrative purposes only and are not drawn to scale. For ease of understanding, identical components will be designated with the same reference numerals throughout the following description.

[0032] The terms “including,” “comprising,” “having,” etc. mentioned in this disclosure are open-ended terms, meaning “including but not limited to.”

[0033] In the description of each embodiment, when terms such as "first," "second," "third," and "fourth" are used to describe elements, they are only used to distinguish these elements from each other and do not limit the order or importance of these elements.

[0034] In the description of each embodiment, the so-called "coupling" or "connection" may refer to two or more elements making direct physical or electrical contact with each other, or making indirect physical or electrical contact with each other, and "coupling" or "connection" may also refer to two or more elements operating or moving with each other.

[0035] In the descriptions of various embodiments, the term "module" refers to a hardware module, i.e., a hardware component that occupies space. In other embodiments, the term "module" may also refer to a hardware module plus a software module, i.e., a module that includes not only hardware components but also software programs.

[0036] In the description of each embodiment, the so-called "lamination" or "bonding" refers to combining two or more layers of materials (such as the chip 50 and the sapphire substrate 60 disclosed herein) together by bonding, pressing or heating.

[0037] Figure 1 is a schematic diagram of an embodiment of a wafer bonding apparatus according to the present disclosure. Figure 2 is a schematic diagram of an embodiment of a wafer bonding apparatus according to the present disclosure during a pressing operation. Figure 3 is a schematic diagram of an embodiment of a wafer bonding apparatus according to the present disclosure after completion of pressing. Referring to Figures 1 through 3, the wafer bonding apparatus 100 of the present disclosure is used to bond a wafer 50 to a sapphire substrate 60. The wafer bonding apparatus 100 includes a lower plate assembly 110, a lifting mechanism 120, a plurality of reset assemblies 130, an upper plate assembly 140, a pressing mechanism 150, a linear drive mechanism 160, a plumb bob assembly 170, and a heating device 180.

[0038] The lower plate assembly 110 is used to support the wafer 50, such that the wafer 50 has a wafer support position PA1. A heating device 180 is connected to the lower plate assembly 110 and provides a heat source. The lifting mechanism 120 has an initial position PB1 and supports the sapphire substrate 60. As shown in FIG1 , a distance DA is defined between the wafer 50 and the sapphire substrate 60. The reset assembly 130 is connected between the lifting mechanism 120 and the lower plate assembly 110. The lifting mechanism 120 can move relative to the lower plate assembly 110 along a first lifting direction LA1 between an initial position PB1 (as shown in FIG1 ) and a downward pressing position PB2 (as shown in FIG2 ). When the lifting mechanism 120 moves to the downward pressing position PB2, the reset assembly 130 provides a restoring force, returning the lifting mechanism 120 to the initial position PB1 (as shown in FIG3 ).

[0039] The upper plate assembly 140 includes a contact surface 142 and a mounting surface 144 facing each other. The contact surface 142 faces the lifting mechanism 120. A downward pressing mechanism 150 is located outside and around the upper plate assembly 140, but does not contact or engage the upper plate assembly 140. The downward pressing mechanism 150 includes a plurality of downward pressing rods 152. The downward pressing rods 152 face the lifting mechanism 120. With reference to a horizontal plane HP, the contact surface 142 of the upper plate assembly 140 is flush with the horizontal plane HP, and the downward pressing rods 152 are positioned to protrude from the contact surface 142 of the upper plate assembly 140. In an optional embodiment, the upper plate assembly 140 may further include a heat source 146.

[0040] The linear drive mechanism 160 is connected to the pressing mechanism 150, and the linear drive mechanism 160 can drive the pressing mechanism 150 to move along a second lifting direction LA2. In this embodiment, the second lifting direction LA2 and the first lifting direction LA1 are both vertical movements, and the vertical movement includes downward and upward directions.

[0041] The plumb bob assembly 170 is connected between the linear drive mechanism 160 and the mounting surface 144 of the upper plate assembly 140. The plumb bob assembly 170 includes three chain elements 172, each of which has one end positioned at a different location on the mounting surface 144 of the upper plate assembly 140. Due to gravity, the upper plate assembly 140 simultaneously pulls on the three chain elements 172, causing each chain element 172 to have a tensioned position PC1.

[0042] Chain element 172 exhibits the structural characteristics of a chain, a mechanical transmission device consisting of a series of connected links, typically used to transmit power, control motion, or secure objects. Chain links are typically made of metal or other durable materials, offering high wear resistance and load-bearing capacity.

[0043] The chain element 172 has the structural characteristics of a chain, so that the chain structure can effectively reduce sliding friction, reduce resistance to a minimum, and almost zero friction, and transmit smoothly, suitable for heavy-load operation and having stability; the chain has high wear resistance and tensile strength, suitable for working in high-intensity and high-load environments and has durability; the chain can adapt to movements at different angles and operate flexibly in a variety of equipment and has flexibility.

[0044] In the aforementioned configurations, as shown in FIG. 1 and FIG. 2 , during the movement of the wafer bonding apparatus 100, the linear drive mechanism 160 drives the pressing mechanism 150 to move along a pressing direction L11. The pressing direction L11 is parallel to the second lifting direction LA2 and is downward, causing the pressing mechanism 150 to move toward the lifting mechanism 120. Simultaneously, the pressing mechanism 150 drives the plumb bob assembly 170 and the upper plate assembly 140 connected thereto to move accordingly.

[0045] Because the downward pressing rod 152 is positioned protruding from the contact surface 142 of the upper plate assembly 140, the downward pressing rod 152 first contacts the lifting mechanism 120, thereby driving the lifting mechanism 120 and the reset assembly 130 connected thereto to move in a downward direction L12 relative to the lower plate assembly 110. Since the sapphire substrate 60 is supported by the lifting mechanism 120, as the lifting mechanism 120 moves in the downward direction L12, the sapphire substrate 60 is also simultaneously moved toward the wafer 50, gradually decreasing the distance DA between the wafer 50 and the sapphire substrate 60. In other words, the sapphire substrate 60 gradually approaches the wafer 50 until the sapphire substrate 60 is positioned above the wafer 50 and lies flat and stable on the wafer 50.

[0046] When the lower pressing rod 152 continues to move in the downward pressing direction L11 relative to the lower plate device 110 until the upper plate device 140 is moved down to a fitting position PD, the contact surface 142 of the upper plate device 140 contacts the sapphire substrate 60, so that the lifting mechanism 120 can move from the initial position PB1 shown in Figure 1 to the downward pressing position PB2 shown in Figure 2, and the reset component 130 has a reset kinetic energy due to being compressed.

[0047] As the upper plate assembly 140 continues to move, the structural characteristics of the chains of the three chain elements 172 form a lead ballast structure, allowing the upper plate assembly 140 to move smoothly in the downward pressure direction L11 without deviating from the position of the horizontal plane HP. This allows the contact surface 142 of the upper plate assembly 140 to be flush with the horizontal plane HP, ensuring that the contact surface of the upper plate assembly 140 is not deviated.

[0048] Thus, it can be seen that the wafer bonding device 100 of this embodiment has a modular design, fast horizontal positioning, the ability to change the downward pressure weight according to different needs, and the use of a plumb bob counterweight. By combining these three chain elements 172 and coordinating with the linear drive mechanism 160, the upper plate device 140 can be smoothly and completely bonded to the sapphire substrate 60.

[0049] When the contact surface 142 of the upper plate assembly 140 contacts the sapphire substrate 60, the plumb bob assembly 170 allows the contact surface 142 of the upper plate assembly 140 to completely adhere to the sapphire substrate 60. Simultaneously, because the sapphire substrate 60 is already flat and stable on the wafer 50, the upper plate assembly 140 forces the sapphire substrate 60 to press against the wafer 50, ensuring a tight fit between the wafer 50 and the sapphire substrate 60.

[0050] It should be noted that, in one embodiment, the surface of wafer 50 may be first coated with liquid wax as a medium. Furthermore, heating device 180 provides a heat source to bond wafer 50 to sapphire substrate 60. Furthermore, in one embodiment, heat source 146 of plate loading device 140 may also provide heat simultaneously to enhance heating and bonding efficiency.

[0051] On the other hand, during the process of the upper plate device 140 descending to the bonding position PD, since the contact surface 142 of the upper plate device 140 is bonded to the sapphire substrate 60, the three chain elements 172 are gradually released from the tensioning position PC1 and have a relaxation position PC2. This is because at this time, the chain element 172 will not generate a force to pull the upper plate device 140 upward and gradually releases. The relaxation position PC2 is the structure of the chain element 172, which can reduce the friction with the upper plate device 140 and reduce the resistance to a minimum, almost to zero friction, so as to achieve the purpose of smoothly transmitting the upper plate device 140, and the flatness of the sapphire substrate 60 bonded to the chip 50 can be improved.

[0052] Next, after the sapphire substrate 60 and the wafer 50 are bonded together, the linear drive mechanism 160 drives the pressing mechanism 150 to move along an upward direction L21, and the upward direction L21 is opposite to the downward direction L11. That is, the upward direction L21 is an upward direction and moves in a direction opposite to the lifting mechanism 120. At the same time, the pressing mechanism 150 also drives the plumb bob assembly 170 and the upper plate device 140 connected thereto to follow the movement.

[0053] This causes the pressing rod 152 to move away from the position of the lifting mechanism 120. Simultaneously, the compression of the reset assembly 130 generates restoring kinetic energy. This restoring kinetic energy allows the reset assembly 130 to lift the lifting mechanism 120, causing the lifting mechanism 120 to move along a restoring direction L22 from the pressing position PB2 shown in FIG. 2 to the initial position PB1 shown in FIG. 3 . Simultaneously, since the wafer 50 is now bonded to the sapphire substrate 60, the movement of the lifting mechanism 120 also lifts the bonded wafer 50 and sapphire substrate 60, causing the wafer 50 to move away from the wafer support position PA1 shown in FIG. 2 and to a finished product position PA2, allowing a robotic arm or a transport mechanism to remove the bonded wafer 50 and sapphire substrate 60.

[0054] Furthermore, as the linear drive mechanism 160 drives the plumb bob assembly 170 and the upper plate assembly 140 connected thereto to follow the movement, the three chain elements 172 are gradually stretched to the tensioned position PC1 in FIG. 3 , allowing the contact surface 142 of the upper plate assembly 140 to remain flush with the horizontal plane HP, thereby ensuring the flatness of the upper plate assembly 140 for the next operation.

[0055] In one embodiment, the contact surface 142 of the upper plate device 140 may be mirror-polished to have a smooth structure, thereby ensuring the flatness of the contact surface 142 of the upper plate device 140 in contact with the sapphire substrate 60 .

[0056] In another embodiment, the lower plate device 110 on which the chip 50 is placed may also be mirror-polished to have a smooth structure, thereby ensuring that the chip 50 can be positioned flat on the lower plate device 110 .

[0057] FIG4 is a perspective schematic diagram of an embodiment of a lower plate device incorporating a lifting mechanism and a reset assembly according to the present disclosure. FIG5 is a perspective schematic diagram of an embodiment of a lower plate device incorporating a lifting mechanism and a reset assembly according to the present disclosure from another angle. FIG6 is a perspective schematic diagram of an embodiment of a lower plate device incorporating a lifting mechanism and a reset assembly according to the present disclosure, with the sapphire substrate 60 omitted in FIG6. Referring to FIG4 through FIG6, the lower plate device 110, lifting mechanism 120, and reset assembly 130 of the present disclosure form a modular design. In one embodiment, the lower plate device 110 includes a bottom plate 112 and a support portion 114 disposed on the bottom plate 112. The bottom plate 112 is, for example, a circular plate structure. The support portion 114 is, for example, a cylindrical structure, and the dimensions of the support portion 114 are smaller than those of the bottom plate 112, for example, the diameter of the bottom plate 112 is larger than the diameter of the support portion 114. In other embodiments, the bottom plate and support portions may have other shapes and configurations.

[0058] The supporting portion 114 of the present disclosure has a supporting surface SA for supporting the wafer 50. The outer surface of the supporting portion 114 is provided with grooves 114A. For example, in FIG6 , there are three grooves 114A, distributed at three locations on the supporting portion 114. For example, if the supporting surface SA is circular, the three grooves 114A are arranged at equal angles on the supporting portion 114, meaning that a groove 114A is provided every 120 degrees. Furthermore, the grooves 114A are recessed portions on the outer surface of the supporting portion 114. In one embodiment, the supporting surface SA can be mirror-polished to a smooth surface, further ensuring that the wafer 50 rests flatly on the supporting surface SA.

[0059] An embodiment of the lifting mechanism 120 disclosed herein includes a buoyancy device 122 and three supporting elements 124. The buoyancy device 122 is, for example, a circular plate structure, the size of which may be roughly the same as the size of the bottom plate portion 112. The buoyancy device 122 is located above the bottom plate portion 112, forming two upper and lower circular plate structures.

[0060] The buoyancy device 122 disclosed herein also includes a hollow portion HA, meaning that the buoyancy device 122 is a hollow disc structure. The hollow portion HA is a hole in the buoyancy device 122, and the outer periphery of the hollow portion HA is the inner side surface S1 of the buoyancy device 122. In other embodiments, the buoyancy device may have other shapes and configurations.

[0061] The three supporting elements 124 disclosed herein are respectively disposed on the inner side surface S1 of the buoyancy device 122. These three supporting elements 124 are protruding structures on the inner side surface S1 of the buoyancy device 122. Furthermore, these three supporting elements 124 are distributed at three locations on the inner side surface S1 of the buoyancy device 122. For example, if the buoyancy device 122 is circular, these three supporting elements 124 are arranged at equal angles on the inner side surface S1 of the buoyancy device 122, meaning that one supporting element 124 is provided every 120 degrees. Furthermore, the number and position of each supporting element 124 correspond to the number and position of the grooves 114A, and the supporting elements 124 are movable within the grooves 114A. For example, in this embodiment, the number of grooves 114A and supporting elements 124 is three. In other embodiments, the number of grooves 114A is adjusted based on the number of supporting elements 124.

[0062] As shown in FIG. 5 , the size of the supporting portion 114 is smaller than that of the buoyancy device 122 . For example, the diameter of the buoyancy device 122 is larger than that of the supporting portion 114 , and the supporting portion 114 is located between the buoyancy device 122 and the bottom plate 112 .

[0063] As shown in FIG6 , the hollow portion HA of the levitation device 122 communicates with the interior of the support portion 114 of the lower plate device 110. This hollow portion HA allows the user to first place the wafer 50 on the support surface SA and then place the sapphire substrate 60 on the three supporting elements 124. In one embodiment, a recess 124A may be provided at the front end of the supporting element 124. A recessed portion of the supporting element 124 forms the recess 124A. These three recesses 124A are used to accommodate the sapphire substrate 60 and to position the sapphire substrate 60. In one embodiment, the supporting element 124 may be mirror-polished to achieve a smooth structure, further ensuring that the sapphire substrate 60 lies flat on the supporting element 124.

[0064] In one embodiment, the surface of the levitation device 122 may be provided with three concave surfaces 122A and a convex surface 122B opposite the concave surfaces 122A. The surfaces of the concave surfaces 122A are lower than the surfaces of the convex surfaces 122B, and the surface of the supporting element 124 is substantially flush with the surface of the convex surfaces. In other words, the surface of the concave surfaces 122A is lower than the surface of the supporting element 124. This structural configuration allows users to remove and place the wafer 50 and sapphire substrate 60, as well as the finished product of the wafer 50 and sapphire substrate 60, from the concave surfaces 122A.

[0065] Furthermore, the number and position of the concave surfaces 122A can correspond to the number and position of the push-down rods 152 shown in Figures 1 to 3 . In other words, the push-down rods 152 will contact the concave surfaces 122A in the buoyancy device 122. In other embodiments, the surface of the buoyancy device is flush without distinction between concave and convex surfaces, and this can be adjusted based on actual conditions.

[0066] The reset assembly 130 shown in Figures 4 through 6 is connected between the buoyancy mechanism 122 of the lifting mechanism 120 and the bottom plate 112 of the lower plate assembly 110, and is positioned around the outside of the support portion 114. Each reset assembly 130 includes an elastic element 132 and a vertical column 134. Each elastic element 132 is connected between the buoyancy mechanism 122 and the bottom plate 112. The position of the downward pressure rod 152 corresponds to the position of the elastic element 132, and each vertical column 134 is connected between the buoyancy mechanism 122 and the bottom plate 112. In this embodiment, the elastic elements 132 and the vertical columns 134 are positioned at different locations. In other embodiments, the elastic elements 132 can be positioned within the vertical columns 134.

[0067] In one embodiment, the position of the upright column 134 corresponds to the position of the convex surface 122B of the buoyancy device 122. The upright column 134 penetrates the convex surface 122B of the buoyancy device 122, and the bottom end of the upright column 134 is fixed to the bottom plate portion 112, allowing the buoyancy device 122 to move relative to the bottom plate portion 112. The length of the upright column 134 extends parallel to the first lifting direction LA1 shown in Figure 1. Therefore, the lifting mechanism 120 can move relative to the lower plate device 110 along the first lifting direction LA1, and the buoyancy device 122 can achieve linear movement along the upright column 134.

[0068] In one embodiment, the position of the pressing rod 152 corresponds to the position of the concave surface 122A in the buoyancy device 122, and the pressing rod 152 will touch the concave surface 122A in the buoyancy device 122. The position of the elastic element 132 corresponds to the concave surface 122A in the buoyancy device 122. If the elastic element 132 is compressed, it can have restoring kinetic energy.

[0069] For example, the lifting mechanism 120 can move from the initial position PB1 shown in FIG. 1 to the depressed position PB2 shown in FIG. 2 , and the elastic element 132 in the restoring assembly 130 is compressed, generating restoring kinetic energy. The restoring kinetic energy causes the elastic element 132 to lift the lifting mechanism 120, causing the lifting mechanism 120 to move along the restoring direction L22 from the depressed position PB2 shown in FIG. 2 to the initial position PB1 shown in FIG. 3 .

[0070] FIG7 is a schematic diagram of an embodiment of a plumb bob assembly and a linear drive mechanism according to the present disclosure. Referring to FIG7 , the linear drive mechanism 260 and plumb bob assembly 270 of the present disclosure are, for example, a specific embodiment of the linear drive mechanism 160 and plumb bob assembly 170 of FIG1 . The linear drive mechanism 260 includes a connecting rod 261, a drive module 262, and a connecting plate 264. The connecting rod 261 is connected between the drive module 262 and the connecting plate 264. The connecting plate 264 is, for example, a plate. The downward pressing mechanism 150 is connected to the connecting plate 264, and the plumb bob assembly 270 is connected between the linear drive mechanism 260 and the mounting surface 144 of the upper plate assembly 140.

[0071] The connecting rod 261 can be, for example, a telescopic rod or other linearly movable member. Thus, the driving module 262 is used to drive the connecting rod 261 to move along the second lifting direction LA2. The connecting rod 261 drives the connecting plate 264, the downward pressing mechanism 150 connected thereto, and the plumb bob assembly 270 to move along the second lifting direction LA2. Through the connection with the plumb bob assembly 270, the upper plate assembly 140 moves accordingly.

[0072] In this embodiment, there are three pressing mechanisms 150, each of which includes a pressing rod 152 and an assembly plate 154, wherein the assembly plate 154 includes an assembly portion 154A, a fixing portion 154B, and a main body portion 154C, and the two ends of the main body portion 154C are the assembly portion 154A and the fixing portion 154B respectively, that is, one end of the main body portion 154C is connected to the assembly portion 154A, and the other end of the main body portion 154C is connected to the fixing portion 154B.

[0073] These three fixing portions 154B are secured to the periphery of the connecting plate 264 through a locking mechanism. The main body 154C of the downward pressing mechanism 150 is spaced apart from the upper plate assembly 140, meaning that the downward pressing mechanism 150 does not contact or engage with the upper plate assembly 140. Meanwhile, one end of the downward pressing rod 152 passes through the assembly portion 154A, while the other end of the downward pressing rod 152 is located outside the assembly portion 154A. In one embodiment, the assembly portion 154A is a plate formed by bending one end of the main body 154C. The assembly portion 154A is formed by bending and extending one end of the main body 154C away from the upper plate assembly 140, so that the main body 154C is located between the upper plate assembly 140 and the assembly portion 154A.

[0074] FIG8 is a perspective schematic diagram of an embodiment of a plumb bob assembly according to the present disclosure. Referring to FIG7 and FIG8 , the plumb bob assembly 270 of this embodiment is, for example, a ball chain structure. The plumb bob assembly 270 includes a ball chain 272, two assembly elements 274, and at least one fixing element 276. The ball chain 272 comprises a plurality of ball links 272A and a chain 272B. The ball chain 272 is a chain composed of a series of ball links 272A, with each ball link 272A connected to an adjacent ball link 272A via a chain 272B. Because the ball links 272A are connected via chain 272B, the ball chain 272 is more flexible than a traditional chain, allowing for free movement at various angles. Each ball link 272A in the ball chain 272 can be considered a separate plumb bob. This design provides even weight distribution and allows for easy adjustment of length or weight to meet specific needs. During operation, the ball chain 272 is required to adjust the center of gravity of the upper plate assembly 140 to prevent excessive vibration or unstable operation. Because the ball chain 272 is adjustable, its length and weight can be adjusted as needed.

[0075] An assembly element 274 is assembled at each end of the ball link 272A. Assembly element 274 includes a receiving member 274A and an insert 274B. One end of receiving member 274A is connected to insert 274B. Assembly element 274 can be formed by bending and connecting two curved plates. Assembly element 274 can be shaped like a plumb bob, for example. Receiving member 274A allows for assembly of a ball link 272A, allowing ball link 272A to be assembled to assembly element 274. Meanwhile, a fixing member 276, such as an insert or a locking member, is sequentially inserted through a hole in insert 274B and the mounting surface 144 of the upper plate assembly 140 to secure the plumb bob assemblies 270 to the mounting surface 144 of the upper plate assembly 140.

[0076] One end of each of the three ball chains 272 is located at a different position on the mounting surface 144 of the upper plate assembly 140. The mounting surface 144 of the upper plate assembly 140 is a circular structure. The ball chains 272 in the three plumb bob assemblies 270 are arranged at equal angles about the center of the mounting surface 144, forming a triangular structure. The structural characteristics of these three ball chains create a plumb weight counterweight, ensuring smooth movement of the upper plate assembly 140. Furthermore, when the ball chains 272 are released (as shown in the released position PC2 in FIG. 2 ), the structure of the ball chains 272 reduces friction with the upper plate assembly 140, minimizing resistance to near-zero friction, thereby achieving smooth movement of the upper plate assembly 140.

[0077] The shape of the above-mentioned lead weight assembly 270 is not limited thereto. As shown in FIG. 9 , the lead weight assembly 370 is a lead weight chain structure. The lead weight chains 372 of the lead weight assembly 370 are shaped like hammers. These lead weight chains 372 are connected together. The bottom end 372B of the lead weight chain 372 is connected to the top end 372A of another lead weight chain 372. Each node of the lead weight chain 372 can be regarded as a separate lead weight.

[0078] For example, the plumb bob assembly 470 shown in FIG. 10 is another type of lead weight chain. The plumb weight chains 472 of the plumb bob assembly 470 are shaped like hammers. These plumb weight chains 472 are connected together, with the bottom end 472B of a plumb weight chain 472 connected to the top end 472A of another plumb weight chain 472. In one embodiment, the top end 472A of each plumb weight chain 472 is provided with a through-hole 472C, and the bottom end 472B of each plumb weight chain 472 passes through the through-hole 472C and connects to the top end 472A of each plumb weight chain 472.

[0079] FIG11 is a three-dimensional schematic diagram of the corresponding positions of the pressing rod and the buoyancy device according to the present disclosure. Please refer to FIG11. The positions of the three pressing rods 152 of the present disclosure correspond to the positions of the three concave surfaces 122A in the buoyancy device 122, so that the three pressing rods 152 will touch the corresponding concave surfaces 122A in the buoyancy device 122. As shown in FIG6, since the three concave surfaces 122A are arranged at equal angles in the buoyancy device 122, that is, a concave surface 122A is provided every 120 degrees, when the three pressing rods 152 touch the corresponding concave surfaces 122A in the buoyancy device 122, they can evenly press down the buoyancy device 122, so that the buoyancy device 122 moves toward the bottom plate 112. In addition, the position of the elastic element 132 corresponds to the position of the buoyancy device 122. When the concave surface 122A and the levitation device 122 move toward the bottom plate 112, the elastic element 132 is compressed, generating restoring kinetic energy. Simultaneously, the upright cylinder 134 located below the convex surface 122B ensures that the levitation device 122 achieves linear movement. This allows the elastic element 132 and the upright cylinder 134, located respectively on the concave surface 122A and convex surface 122B of the levitation device 122, to exert both restoring kinetic energy and linear movement. This allows the levitation device 122 to receive evenly distributed force during linear movement without deflection, further ensuring that the sapphire substrate 60 remains flat against the wafer 50 and that the contact surface 142 of the upper plate device 140 maintains its flatness in contact with the sapphire substrate 60. In other embodiments, the elastic element 132 and the upright cylinder 134 may be integrated into the same component.

[0080] Figure 12 is a perspective schematic diagram showing the corresponding positions of the pressing mechanism, the lifting mechanism, and the lower plate assembly according to the present disclosure from another perspective. Figure 13 is a partially enlarged perspective schematic diagram of the horizontal adjustment mechanism and plumb bob assembly according to the present disclosure. Figure 14 is a partially enlarged side schematic diagram of the horizontal adjustment mechanism and plumb bob assembly according to the present disclosure. Referring to Figures 12 to 14, the wafer bonding apparatus 200 of the present disclosure further includes a horizontal adjustment mechanism 290. One end of the horizontal adjustment mechanism 290 is fixed to the connecting plate 264 of the linear drive mechanism 260, and the other end of the horizontal adjustment mechanism 290 is connected to the assembly element 274 of the plumb bob assembly 270.

[0081] The horizontal adjustment mechanism 290 of this embodiment is used to adjust the horizontal position of the plumb bob assemblies 270 so that these plumb bob assemblies 270 can be at the same horizontal position, thereby ensuring that these plumb bob assemblies 270 pull the upper plate device 140 on the same horizontal plane, allowing the upper plate device 140 to maintain the same horizontal plane without deviation.

[0082] In one embodiment, a fixing member 276 is sequentially inserted through a hole in the insert member 274B and the mounting surface 144 of the upper plate assembly 140, thereby securing one end of each plumb bob assembly 270 to the mounting surface 144 of the upper plate assembly 140, serving as a fixed end. Meanwhile, the other end of the plumb bob assembly 270 is connected to the connecting plate 264 via a horizontal adjustment mechanism 290, serving as an adjustment end. The horizontal adjustment mechanism 290 maintains a distance between the plumb bob assembly 270 and the connecting plate 264. The horizontal adjustment mechanism 290 allows the plumb bob assembly 270, and thus the distance between the plumb bob assembly 270 and the connecting plate 264, to be adjusted.

[0083] In one embodiment, the horizontal adjustment mechanism 290 includes a screw 292, a connecting portion 294, and a screw adjustment portion 296. One end of the screw 292 is rotatably disposed on the connecting plate 264, and the other end of the screw 292 is connected to the connecting portion 294. The connecting portion 294 can be a part of the screw 292 or another component, and the connecting portion 294 is bent at one end of the screw 292 so that the screw 292 is perpendicular to the surface 264A of the connecting plate 264, and the connecting portion 294 is roughly parallel to the surface 264A of the connecting plate 264, and there is a distance between the connecting portion 294 and the surface 264A of the connecting plate 264.

[0084] Taking Figure 13 as an example, the insert 274B of the plumb bob assembly 270 is mounted on the connecting portion 294 of the horizontal adjustment mechanism 290. In this embodiment, the connecting portion 294 is inserted through the hole of the insert 274B to assemble the plumb bob assembly 270 to the horizontal adjustment mechanism 290. The screw thread adjustment portion 296 is, for example, a nut. The screw thread adjustment portion 296 secures the screw thread 292 to the connecting plate 264, and the screw thread adjustment portion 296 contacts the surface 264A of the connecting plate 264.

[0085] In this structural arrangement, one embodiment can adjust the position of screw 292 within connecting plate 264 by rotating screw adjustment portion 296 to rotate screw 292, thereby enabling screw 292 to move in an adjustment direction LA3. Adjustment direction LA3 is parallel to the second lifting direction LA2 shown in FIG. 1 , that is, the position of screw 292 can be adjusted by rotating in a vertical direction. Thus, adjusting the position of screw 292 causes the position of connecting portion 294 to move in adjustment direction LA3, causing the position of connecting portion 294 relative to surface 264A of connecting plate 264 to change, thereby driving assembly element 274 to move along with ball chain 272 connected thereto, thereby adjusting the height position of plumb bob assembly 270.

[0086] FIG15 is a perspective view of another embodiment of a wafer bonding apparatus according to the present disclosure. Referring to FIG15 , the wafer bonding apparatus 400 of the present disclosure further includes a vacuum chamber 80 and an exhaust device 90 . The exhaust device 90 is connected to the vacuum chamber 80 . The vacuum chamber 80 defines a accommodating space BM therein. The exhaust device 90 is used to evacuate the accommodating space BM within the vacuum chamber 80 to achieve a vacuum state within the vacuum chamber 80 . In this vacuum state, when air bubbles are completely eliminated, the sapphire substrate 60 is bonded to the wafer 50 with improved bonding performance.

[0087] In this embodiment, the lower plate assembly 110, lifting mechanism 120, reset assembly 130, upper plate assembly 140, downward pressure mechanism 150, plumb bob assembly 270, and heating device 180 are located within the accommodation space BM within the vacuum chamber 80. The vacuum chamber 80 includes a plurality of peripheral side panels 82, a top panel 84, and a bottom panel 85. These peripheral side panels 82 can have various shapes depending on the configuration of the vacuum chamber 80. The top panel 84 and bottom panel 85 are respectively mounted above and below the peripheral side panels 82 to form the vacuum chamber 80. The lower plate assembly 110, lifting mechanism 120, and reset assembly 130 are connected to the heating device 180, which is located above the bottom panel 85. This allows the lower plate assembly 110, lifting mechanism 120, and reset assembly 130 to be positioned within the vacuum chamber 80.

[0088] By using the vacuum state of the vacuum chamber 80, bubbles on the bonding surface of the sapphire substrate 60 and the chip 50 as shown in FIG. 1 can be completely eliminated, thereby improving the bonding effect between the sapphire substrate 60 and the chip 50.

[0089] The linear drive mechanism 360 includes a connecting rod 361, a drive module 362, a fixing element 363, and a connecting plate 364. The drive module 362 includes a drive motor 362A and a slide mechanism 362B. The drive motor 362A is connected to the slide mechanism 362B. One end of the connecting rod 361 is connected to the slide mechanism 362B, and the other end of the connecting rod 361 is connected to the connecting plate 364. The connecting plate 364 is connected to the downward pressure mechanism 150, which in turn connects the plumb bob assembly 270 and the upper plate device 140 through the downward pressure mechanism 150.

[0090] In this way, one end of the connecting rod 361 is movably positioned within the vacuum chamber 80. The drive motor 362A drives the slide mechanism 362B to move along the second lifting direction LA2. The slide mechanism 362B drives the connecting rod 361 to move, and the connecting rod 361 drives the downward pressing mechanism 150 to move, so that the downward pressing mechanism 150, the plumb bob assembly 270 connected thereto, and the upper plate device 140 can move along the second lifting direction LA2.

[0091] In addition, in one embodiment, the first assembly end G1 of the fixing element 363 is fixed to the top plate 84 of the vacuum chamber 80, and the second assembly end G2 of the fixing element 363 is fixed to the connecting plate 364. The connecting rod 361 can be accommodated in the fixing element 363.

[0092] FIG16 is a perspective schematic diagram of another embodiment of a wafer bonding apparatus according to the present disclosure. Referring to FIG16 , the linear drive mechanism 460 of this embodiment may be a specific embodiment of the linear drive mechanism 360 of FIG15 . The drive motor 462A in the drive module 462 is connected to a slide mechanism 462B. The slide mechanism 462B may be a slider-guide rail mechanism comprising a slider element 4622 and a guide rail element 4624. The slider element 4622 is movably mounted on the guide rail element 4624, and one side of the slider element 4622 is connected to the connecting rod 361.

[0093] The driving motor 462A is used to drive the slider element 4622 to move relative to the guide rail element 4624, that is, the structure of the guide rail element 4624 can provide linear movement of the slider element 4622, so that the slider element 4622 can move up and down along the second lifting direction LA2, thereby linking the connecting rod 361 to move up and down along the second lifting direction LA2.

[0094] On the other hand, the top plate 84 of the vacuum chamber 80 may be provided with a through hole 842 for the connecting rod 361 to pass through. The connecting rod 361 passes through the through hole 842 so that one end of the connecting rod 361 is located inside the vacuum chamber 80.

[0095] In addition, the vacuum chamber 80 further includes a door panel 86 rotatably connected to the peripheral side panels 82. The door panel 86 can be rotated to close or open the vacuum chamber 80. In one embodiment, the door panel 86 can further be provided with a transparent viewing area 88, allowing the operation of the wafer bonding apparatus to be observed from outside the vacuum chamber 80.

[0096] FIG16 illustrates, in conjunction with FIG1 , a specific implementation process: sapphire substrate 60 is placed on lifting mechanism 120 , and wafer 50 is placed on lower plate assembly 110 , thereby placing sapphire substrate 60 and wafer 50 within vacuum chamber 80 . Next, door 86 of vacuum chamber 80 is closed. Then, exhaust device 90 evacuates the interior of vacuum chamber 80 to create a vacuum state within vacuum chamber 80 . Next, heat source 146 and heating device 180 of upper plate assembly 140 are simultaneously heated to 180°C. Upper plate assembly 140 then descends to bonding position PD (as shown in FIG2 ) and remains in bonding position for 5 minutes. Next, the temperature of heat source 146 and heating device 180 of upper plate assembly 140 is lowered to 140°C. Door 86 of vacuum chamber 80 is then opened, and air is blown to dissipate heat. Finally, upper plate assembly 140 ascends and returns to its original position. Finally, the reset kinetic energy of the reset assembly 130 is used to move the lifting mechanism 120, and the bonded chip 50 and sapphire substrate 60 are simultaneously lifted to the finished product position PA2 (as shown in FIG. 3 ), and the bonded chip 50 and sapphire substrate 60 are taken out.

[0097] In summary, the present disclosure discloses that during the process of the upper plate device descending to the bonding position, the three chain elements gradually release from the tightened position to a relaxed position. This is because at this time, the chain elements do not generate a certain amount of force when pulling the upper plate device upward, and gradually release, thereby reducing friction with the upper plate device and minimizing resistance to almost zero friction, thereby achieving the purpose of smoothly driving the upper plate device and improving the flatness of the sapphire substrate when bonding to the wafer.

[0098] Furthermore, the structural characteristics of the chain of the chain element disclosed herein form a plumb bob counterweight structure, which allows the upper plate device to move smoothly without deviating from the horizontal position, ensuring that the contact surface of the upper plate device is not deviated, thereby allowing the contact surface of the upper plate device to be flatly attached to the sapphire substrate.

[0099] In addition, one embodiment uses a vacuum chamber. Under the condition of complete elimination of air bubbles in a vacuum state, the sapphire substrate can be bonded to the wafer with better bonding effect.

[0100] In addition, the contact surface of the upper plate device that contacts the sapphire substrate, the lower plate device for placing the chip, and the top holding element and its concave portion that support the sapphire substrate in one embodiment can all have a smooth structure through mirror polishing.

[0101] Furthermore, one embodiment may provide a horizontal adjustment mechanism to adjust the horizontal position of the plumb bob assemblies so that these plumb bob assemblies can be at the same horizontal position, thereby ensuring that these plumb bob assemblies pull the upper plate device at the same horizontal plane, allowing the upper plate device to maintain the same horizontal plane without deviation, thereby allowing the contact surface of the upper plate device to be flatly attached to the sapphire substrate.

[0102] In addition, when the pressing rod moves away from the lifting mechanism, the reset component resets the kinetic energy to lift the lifting mechanism, and the bonded wafer and sapphire substrate are also lifted at the same time to the finished product position.

[0103] Although the present disclosure has been disclosed above with reference to the embodiments, they are not intended to limit the present disclosure. Anyone with ordinary skill in the art may make slight changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the scope of the appended patent applications.

[0104] 50: Chip 60: Sapphire substrate 80: Vacuum chamber 82:Surrounding side panels 84: Top plate 842:Piercing 85: Base plate 86: Door panel 88: Viewing Area 90: Exhaust device 100, 200, 400: Wafer bonding device 110: Lower plate device 112: bottom plate 114: bearing part 114A: Groove 120: Lifting mechanism 122: Floating device 122A: Concave 122B: convex 124: Supporting element 124A: concave part 130: Reset component 132: Elastic element 134: upright column 140: Upper plate device 142: Contact surface 144: Setting the surface 146: Heat Source 150: Pressing mechanism 152: Downward pressure rod 154: Assemble panels 154A: Assembly Department 154B:Fixed part 154C:Body 160, 260, 360, 460: Linear drive mechanism 170, 270, 370, 470: Plumb bob assembly 172: Chain element 180: Heating device 261,361: Connecting rods 262,362,462:Driver module 264,364: Connecting plate 264A: Surface 272: Ball chain 272A: Ball Link 272A:Chain 274:Assembly components 274A: accommodating part 274B: Insert 276:Fixer 290: Horizontal adjustment mechanism 292: screw thread 294:Connection 296: Screw adjustment part 362A, 462A: Drive motor 362B, 462B: Sliding mechanism 363:Fixing element 372,472:Plumb chain 372A, 472A: Top 372B, 472B: bottom 4622: Slider element 4624:Guide rail components 472C: Perforation BM: Accommodation space DA: Set distance G1: First assembly end G2: Second assembly end HA:Hollow part HP: horizontal plane L11: downward pressure direction L12: descending direction L21: rising direction L22: Reset direction LA1: First lifting direction LA2: Second lifting direction LA3: Adjust direction PA1: Wafer loading position PA2: Finished product position PB1: Initial position PB2: Press down position PC1: tension position PC2: Relaxed position PD: fitting position S1: medial surface SA: Bearing surface

Claims

1. A wafer bonding device for bonding a wafer to a sapphire substrate, the wafer bonding device comprising: a lower plate device for supporting the wafer; a heating device connected to the lower plate device; a lifting mechanism for carrying the sapphire substrate; 7. The swiftly and minutely adjusting device for a wood-planer working table as claimed in claim 1, wherein said linking rod and said adjusting base are pivotally connected to each other with a bolt, and said bolt has a round shank to contact with said linking rod. said linking rod having a check valve in said linking rod and a check valve in said linking rod. said linking rod has a check valve in said linking rod and a check valve in said linking rod.

2. A chip bonding device as described in claim 1, wherein the lifting mechanism is capable of moving between an initial position and a pressing position relative to the lower plate device, when the lifting mechanism is in the initial position, the chip has a chip supporting position, the linear drive mechanism drives the pressing mechanism to move in a pressing direction, and the pressing mechanism drives the plumb bob assembly and the upper plate device connected thereto to move, when the upper plate device is moved to a bonding position, the contact surface of the upper plate device contacts the sapphire substrate, the lifting mechanism moves from the initial position to the pressing position, and the reset components have a reset kinetic energy.

3. A chip bonding device as described in claim 2, wherein the linear drive mechanism drives the downward pressure mechanism to move in an upward direction, and the downward pressure mechanism drives the plumb bob assembly and the upper plate device connected thereto to follow the movement, and the upward direction is opposite to the downward pressure direction, so that the downward pressure rods move away from the lifting mechanism, and the reset kinetic energy of the reset components causes the lifting mechanism to move from the downward pressure position to the initial position, and the chip and the sapphire substrate that have been bonded are also lifted, so that the chip is separated from the chip supporting position and is located at a finished product position.

4. The wafer bonding apparatus according to claim 1, wherein the number of the chain elements is three, and the three chain elements form a plumb bob counterweight structure.

5. The wafer bonding apparatus according to claim 1, wherein the plumb bob assembly is a ball chain structure or a plumb chain structure.

6. The chip bonding device as described in claim 5, wherein the plumb bob assembly is a ball chain structure, the plumb bob assembly includes a ball chain, each of the ball chains includes a plurality of ball links and a chain, and each of the ball links is connected to the adjacent ball links through the chain.

7. The wafer bonding apparatus according to claim 5, wherein the plumb bob assembly is a plumb bob chain structure, the plumb bob assembly comprises a plumb bob chain, and the bottom end of each plumb bob chain is connected to the top end of another plumb bob chain.

8. The wafer bonding apparatus according to claim 1, further comprising: A vacuum chamber, wherein the lower plate device, the lifting mechanism, the reset components, the upper plate device, the pressing mechanism, the plumb bob component, and the heating device are respectively located within the vacuum chamber; and an exhaust device is connected to the vacuum chamber, and the exhaust device is used to exhaust air from the vacuum chamber.

9. The wafer bonding apparatus according to claim 1, further comprising: A horizontal adjustment mechanism is connected to the plumb bob assembly, wherein the linear drive mechanism includes a connecting plate, and the horizontal adjustment mechanism includes a screw, a connecting portion, and a screw adjustment portion. One end of the screw is rotatably disposed on the connecting plate, and the other end of the screw is connected to the connecting portion, and a distance is separated between the connecting portion and the connecting plate.

10. The wafer bonding device according to claim 1, wherein the pressing mechanism is spaced apart from the upper plate device by a distance.

11. The wafer bonding device according to claim 1, wherein the position of the pressing rod is such that it protrudes from the contact surface of the upper plate device.

12. A chip bonding device as described in claim 1, wherein the lower plate device includes a bottom plate portion and a supporting portion, the supporting portion is arranged on the bottom plate portion, the supporting portion has a supporting surface, and three grooves are arranged on one outer surface of the supporting portion, the lifting mechanism includes a floating device, a hollow portion, and three supporting elements, the hollow portion is a hole of the floating device, the hollow portion is connected to the interior of the supporting portion of the lower plate device, the three supporting elements are a protruding structure on an inner side surface of the floating device, and the position of each supporting element corresponds to the position of the groove, and each supporting element can move within the corresponding groove.

13. The wafer bonding device according to claim 12, wherein each of the reset components comprises an elastic element, the elastic elements are respectively connected between the levitation device and the bottom plate, and the positions of the pressing rods correspond to the positions of the elastic elements.

14. The wafer bonding device according to claim 13, wherein each of the resetting components comprises a vertical column, the vertical columns are penetrated through the levitation device, and the bottom ends of the vertical columns are fixed to the bottom plate.

15. The wafer bonding device according to claim 12, wherein a recess is provided at a front end of the supporting element.

16. The wafer bonding apparatus according to claim 12, wherein the supporting element has a smooth structure.

17. A chip bonding device as described in claim 12, wherein the surface of the lifting device is provided with three concave surfaces and three convex surfaces, the surfaces of the concave surfaces are lower than the surfaces of the convex surfaces, and the surface of each of the supporting elements is flush with the surface of the corresponding convex surface, and the positions of the pressing rods correspond to the positions of the concave surfaces in the lifting device.

18. The chip bonding device according to claim 1, wherein the contact surface of the upper plate device is a smooth structure.

19. The chip bonding device as described in claim 1, wherein the linear drive mechanism includes a connecting rod, a driving module, and a connecting plate, the connecting rod is connected between the driving module and the connecting plate, and the pressing mechanism is connected to the connecting plate.

20. The chip bonding device as described in claim 19, wherein the driving module includes a driving motor and a slide mechanism, the driving motor is connected to the slide mechanism, one end of the connecting rod is connected to the slide mechanism, and the other end of the connecting rod is connected to the connecting plate.

21. The wafer bonding device according to claim 1, wherein the lower plate device has a smooth structure.

22. The wafer bonding device according to claim 1, wherein the upper plate device is provided with a heat source.

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