Semiconductor processing tool and methods of operation

Abstract

A semiconductor processing tool includes one or more devices that are configured to inspect sealant dispensed into and / or around a groove around a wafer stack. The one or more devices may be used to determine whether a sufficient amount of sealant is dispensed into the groove and / or whether errant sealant particles landed on the top and / or bottom surfaces of the wafer stack. This enables the semiconductor processing tool to cause a reseal operation to be performed to dispense additional sealant into the groove if an insufficient amount of sealant was dispensed into the groove, and / or enables the semiconductor processing tool to cause a cleaning operation to be performed to clean the top and / or bottom surfaces of the wafer stack.