Substrate processing apparatus and substrate processing method

Abstract

This invention relates to a substrate processing apparatus and a substrate processing method for preventing wafer warpage during semiconductor wafer manufacturing. The substrate processing apparatus may include: a stage unit on which a wafer is mounted; a clamping unit including a plurality of handle modules arranged along the outer periphery of the stage unit, wherein the handle modules are configured to be driven to move up and down relative to the mounting surface of the stage unit or to rotate relative to the central axis of the stage unit, thereby clamping the wafer and mounting it onto the mounting surface of the stage unit or aligning the wafer to a precise position on the mounting surface of the stage unit; and a control unit electrically connected to the stage unit and the clamping unit and controlling the stage unit and the clamping unit.

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