Chuck structure and semiconductor test method using the same

Abstract

This technology relates to a semiconductor testing method utilizing a chuck structure. The chuck structure according to this technology may include: a chuck with a thin film disposed on one side, the thin film having a plurality of grains disposed thereon, and a plurality of grooves formed on the same side for adsorbing the thin film; and an ultraviolet irradiation section disposed on the lower part of the chuck to irradiate the thin film with ultraviolet light. According to this technology, a chuck structure that can weaken the adhesion of the thin film while maintaining grain flatness and a semiconductor testing method utilizing the same are provided.

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