Substrate carrier, crystal boat and furnace tube equipment

Abstract

This disclosure relates to a substrate carrier, a crystal boat, and a furnace tube apparatus, belonging to the field of semiconductor manufacturing equipment. The substrate carrier includes at least one trench, at least one through-hole, and a substrate contact area. At least one trench is formed on the upper surface of the substrate carrier, and at least one through-hole penetrates the substrate carrier. The substrate contact area is used to contact the substrate during substrate support. Both the at least one trench and the at least one through-hole are located within the substrate contact area. The design of the trench and through-hole reduces the effective contact area between the substrate and the substrate carrier. Gas can enter the substrate contact area through the through-hole, thereby forming an air layer between the two. The trench and through-hole design helps prevent the substrate from adhering to the substrate carrier after high-temperature processing, improving the substrate processing yield.

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