Method of pre-adjusting the glass substrate processing surface for a glass substrate semiconductor package

Abstract

The present invention relates to a method of pre-adjusting a working surface of a glass substrate for a glass substrate semiconductor package to significantly shorten manufacturing time and improve manufacturing efficiency by pre-adjusting the glass substrate such that a current surface of the glass substrate corresponds to a working surface for a manufacturing process. The method includes selecting one material group from among a plurality of material groups, collecting processing process information based on processing equipment, checking, by using the processing process information, whether transfer equipment associated with processing equipment for performing a current processing process and transfer equipment associated with processing equipment for performing a next processing process, which is subsequent in order from the current processing process, are each provided with a flipper, and pre-adjusting each of the glass substrates by rotating the glass substrate.

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