Components for semiconductor manufacturing equipment

Abstract

The wafer stage 10 includes: a ceramic plate 20 with an internal electrostatic electrode 22; a substrate 30 with an internal refrigerant flow path 32; a substrate through-hole 34 penetrating the substrate 30 vertically at a position offset from the center of the substrate 30; an insulating tube 50 inserted into the substrate through-hole 34; a power supply member 70 inserted into the insulating tube 50 and electrically connected at its front end to the electrostatic electrode 22; and an adhesive layer 60 having a first bonding portion 61 disposed in a first gap G1 between the insulating tube 50 and the substrate through-hole 34 and a second bonding portion 62 disposed in a second gap G2 between the insulating tube 50 and the power supply member 70. The bottom surface 70b of the power supply member 70 is located below the bottom surface 30b of the refrigerant flow path 32. At least one of the bottom surface 61b of the first bonding portion 61 and the bottom surface 62b of the second bonding portion 62 is located at the same height as or above the bottom surface 32b of the refrigerant flow path 32.