Chuck for die level testing and level testing equipment including same

TW202630906APending Publication Date: 2026-07-16SEMICS INC
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Patent Information

Application Number
TW114150168
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-06-30
Filing Date
2025-12-19
Publication Date
2026-07-16
Patent Text Reader

Abstract

A chuck for grain level testing may include: a movable chuck supporting a plurality of grains, and a chuck base disposed below the movable chuck, wherein the movable chuck includes: a plate defining a plurality of vacuum adsorption holes, and partitions disposed on the upper surface of the plate, surrounding at least one or more vacuum adsorption holes when viewed in a plane.
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