Substrate processing system, method for controlling moisture in substrate processing system, and regeneration system

TW202630928APending Publication Date: 2026-07-16ASM IP HLDG BV
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
ASM IP HLDG BV
Filing Date
2025-10-28
Publication Date
2026-07-16

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Abstract

A substrate processing system is provided for effective moisture control during fabrication operations. The system includes a buffer chamber with a cooling plate, which is coupled to a cryogenic pump to circulate a cryogen, such as liquid nitrogen. Residual moisture and water vapor released during substrate transfer are captured and condensed onto the cooling plate. A regeneration system monitors moisture accumulation using sensors and initiates regeneration when a set threshold is reached.
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